| Allicdata Part #: | ATS-04E-69-C1-R0-ND |
| Manufacturer Part#: |
ATS-04E-69-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-69-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.49°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are essential components in the applications of electronics cooling, heat dissipation, and thermal management. The ATS-04E-69-C1-R0 series heat sink is the latest and most innovative solution from Thermal, a leading manufacturer of heat dissipation solutions. This series of heat sink is specifically designed for mid-range devices, providing reliable, efficient thermal management with a low total cost of ownership.
Application Field of ATS-04E-69-C1-R0The ATS-04E-69-C1-R0 series heat sink is ideal for applications requiring support up to 69 watts of heat. It is designed for use with CPU coolers, GPU coolers, and other mid-range device cooling systems. The heat sink is designed in a slim form factor and features a unique fin design that offers easy installation and removal. The ATS-04E-69-C1-R0 is recommended for applications such as home PCs, gaming consoles, and industrial grade electronic equipment.
Working Principle of ATS-04E-69-C1-R0The ATS-04E-69-C1-R0 works by dissipating heat away from the device or component it is attached to. Heat is conducted away from the device through a thermal conduction plate that is attached to the heat sink. This thermal conduction plate is then connected to a set of specially designed fins on the heat sink. These fins are designed to increase the surface area of the heat sink, allowing for improved heat dissipation. The highly efficient heat sink material and fin design allow for effective and efficient heat dissipation, even in high temperatures.
In addition to dissipating heat from the device or component, the ATS-04E-69-C1-R0 works to actively cool the system. This is done by using a fan or other cooling method to draw heat away from the heat sink and dissipate it into the surrounding air. This ensures that the system remains cool even during periods of high usage.
Overall, the ATS-04E-69-C1-R0 is the ideal choice for mid-range device cooling and thermal management. It is an efficient, reliable, and cost-effective solution for all types of applications. With its high-performance fan or cooling system and its slim design, the ATS-04E-69-C1-R0 provides an excellent solution for any cooling needs.
The specific data is subject to PDF, and the above content is for reference