| Allicdata Part #: | ATS-04E-80-C3-R0-ND |
| Manufacturer Part#: |
ATS-04E-80-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-80-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are a type of heat transfer device used to dissipate heat generated from electronic components. The ATS-04E-80-C3-R0 is a particularly effective example of such a device, and is commonly used across a wide spectrum of applications. The device is a passive cooling solution, meaning it doesn\'t require any external energy to operate. This article will cover the applications and working principle of the ATS-04E-80-C3-R0.
The ATS-04E-80-C3-R0 is designed to be used in a variety of applications. It can be used in thermal management of industrial electronics, such as motor controls, inverters, and converters. It is also useful in applications involving automotive, aviation, and medical electronics, and is effective in cooling electronic components in these contexts. Additionally, the device is suitable for use in communications, personal computer, and other consumer electronics equipment.
The ATS-04E-80-C3-R0 is a highly efficient solution compared to conventional cooling methods. It is made of metal alloy with high thermal conductivity, maximizing its heat dissipation capabilities. Its simple design also makes it simpler to install than many traditional cooling solutions. Furthermore, the device is easy to maintain, as it does not require any active maintenance.
The working principle of the ATS-04E-80-C3-R0 is based on the concept of thermal conduction. Thermal conduction is a method of transferring heat energy from one object to another. In the case of the ATS-04E-80-C3-R0, thermal conduction is achieved by making use of a series of ‘fins’ which are made of highly thermally conductive material. The fins act as a pathway for the heat transfer from the source (hot area) to the sink (cold area), the heat being dissipated in the process.
Heat transfer is accomplished through the fins in three steps. First, the heat is conducted from the source area to the fin. Second, the heat is conducted within the fin itself. Lastly, the heat is conducted from the fin to the sink area. This process is then repeated until the heat is completely dissipated from the source, and the electronic component(s) is cooled accordingly.
The ATS-04E-80-C3-R0 is a highly effective and efficient cooling device, and is suitable for use in a variety of applications. Its simple yet effective design make it easy to install and maintain, while its thermally conductive material ensures maximum heat dissipation. By making use of the principles of thermal conduction, the device is able to effectively dissipate heat in a highly efficient manner.
The specific data is subject to PDF, and the above content is for reference