ATS-04E-85-C3-R0

Thermal solutions are essential components of modern electronics, as they allow efficient and reliable operation in many different operating environments. The ATS-04E-85-C3-R0 is a heat sink designed to provide efficient heat transfer from electronic components such as processors, FPGAs, GPUs, and other integrated circuits. It offers excellent thermal performance in a variety of environments, including both extreme and ambient temperatures.

The ATS-04E-85-C3-R0 features a copper base with a plated aluminum top plate. This combination improves the heat conductivity of the heat sink, which in turn improves the overall thermal performance of the system. Additionally, the surface of the plate is designed to improve surface area contact and improve heat transfer. The design of this heat sink also allows it to be used with a variety of high-end electronics, including those used in high-demand applications such as artificial intelligence, autonomous vehicles, and 5G network infrastructure.

The ATS-04E-85-C3-R0 is designed to provide an optimal cooling effect through a combination of heat dissipation and air flow. The heat sink is designed with a series of fins which increase the surface area available for heat dissipation. The fins disperse heat rapidly and efficiently, allowing the heat to be quickly dissipated and kept away from sensitive electronics. Additionally, the heat sink is designed with an airflow system, which allows air to pass through the ribs, increasing the rate of heat dissipation. Additionally, the air flow is designed to provide optimal cooling, reducing the chances of overheating and preventing damage to sensitive components.

The ATS-04E-85-C3-R0 also features a unique ventilated design, with a center opening to allow air to pass through. This feature allows cool air to circulate around the system and reduce the chances of overheating. Additionally, the design prevents dust and other particles from entering the system, further reducing the risk of damage. The ATS-04E-85-C3-R0 is also designed to be highly durable and can withstand high temperatures and vibration.

In summary, the ATS-04E-85-C3-R0 is a high-performance heat sink designed to provide efficient heat transfer from electronic components. It features a combination of copper and aluminum materials, which increase the heat conductivity of the system. Additionally, the design also features an airflow system which reduces the chances of overheating. Additionally, the unique ventilated design allows for optimal cooling and protection from dust and other particles. The ATS-04E-85-C3-R0 is an ideal solution for applications that require efficient and reliable heat dissipation.