| Allicdata Part #: | ATS-04E-99-C3-R0-ND |
| Manufacturer Part#: |
ATS-04E-99-C3-R0 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-99-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.07169 |
| 30 +: | $ 3.84531 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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- Thermal - Heat Sinks
The ATS-04E-99-C3-R0 heat sink is a type of cooling component designed to dissipate excess heat generated through operations in an electrical/mechanical system. It acts as a “radiator” to effectively transfer heat away from the source. To achieve this, the thermal heat sink relies on the process of forced convection, in which both cold and hot air are directed onto the surface of the heat sink in order to balance the temperature and keep the system’s components cool.
The ATS-04E-99-C3-R0 is typically composed of a extruded aluminum block and several fins which form a larger surface area, providing an increased opportunity for heat to be released through the medium of air. Heat pipes, liquid channels and fans are frequently incorporated to increase the cooling capacity, further decrease the component’s operational temperature and ensure extended lifetime.
The ATS-04E-99-C3-R0 is suitable for a variety of scenario—particularly where space limitations or processing power increases temperatures beyond what can be handled by an ordinary heat sink. Additionally, its excellent thermal conductivity and high efficiency make it a cost effective and favoured solution for fields such as electrical engineering, electronic equipment, industrial goods, communications technology and automotive engineering.
The working principle of the ATS-04E-99-C3-R0 is straightforward. Once the heat sink is mounted on the CPU, a small but powerful fan draws the hot air from the CPU up towards the heat sink. The thermal compound applied to the CPU helps boost the performance of the heat sink. The heat sink then dissipates the heat in two ways: while the base absorbs the heat and conducts it away, the fins above the base dissipate the heat through convection.
The larger surface area of the fins enables increased dissipation when compared to conventional heat sinks, making the ATS-04E-99-C3-R0 an ideal choice for operating systems where more demands are being placed on the CPU. When the temperature is too high, the fan will speed up and continuously cool the system and ensure that the CPU remains cool yet efficient.
The specific data is subject to PDF, and the above content is for reference