| Allicdata Part #: | ATS-04F-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-04F-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to ensure that components and systems operate reliably over expected life cycles. Thermal engineers use a variety of techniques and materials in the design of thermal management solutions. One of these solutions is the use of a heat sink, which is a device that dissipates heat from a device into its surroundings. The ATS-04F-02-C3-R0 is such a product and has been designed for use in industrial and telecommunications environments and has a number of unique features that make it particularly well suited to this application.
The ATS-04F-02-C3-R0 is a 4"X4" heat sink designed for use in industrial and telecommunications applications. It is a high-performance, low-profile heat sink that utilizes an array of fins for maximum heat transfer efficiency. The fins are arranged in a staggered pattern which reduces turbulence and air resistance. The heat sink also features a low density aluminum frame that maximizes the thermal performance of the device. The design of the frame also ensures that the device is able to fit in tight spaces, such as within an electric switchboard.
The ATS-04F-02-C3-R0 heat sink is also designed to be used in a wide range of ambient environments. It can be used in temperatures ranging from -40°C to +125°C and can also withstand pressure and humidity. Its wide temperature range and rugged construction make it suitable for use in both industrial and telecommunications applications.
The ATS-04F-02-C3-R0 heat sink utilizes a unique design that enables it to dissipate heat efficiently from the device itself and to its surroundings. This is accomplished through a combination of convection and radiation cooling. Convection cooling occurs when heated air has the opportunity to rise from the device and is then replaced by cooler air from the environment. Radiation cooling occurs when heat is radiated from the device to its surroundings. This is especially useful for applications where the environmental temperature is much cooler than the device’s operating temperature.
The ATS-04F-02-C3-R0 heat sink is a reliable and efficient solution for thermal management in industrial and telecommunications applications. Its low profile design enables it to fit into tight spaces and its wide temperature range makes it ideal for use in a variety of environments. Its unique design also allows for heat to be dissipated efficiently, ensuring the reliability of the device over its expected life cycle.
The specific data is subject to PDF, and the above content is for reference