ATS-04F-10-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS8392-ND

Manufacturer Part#:

ATS-04F-10-C2-R0

Price: $ 4.19
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04F-10-C2-R0 datasheetATS-04F-10-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.80520
10 +: $ 3.70125
25 +: $ 3.49574
50 +: $ 3.29011
100 +: $ 3.08448
250 +: $ 2.87885
500 +: $ 2.67322
1000 +: $ 2.62181
Stock 1000Can Ship Immediately
$ 4.19
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are important for many applications, including electronics, as heat impacts many components in a system. The ATS-04F-10-C2-R0 is a heat sink solution suitable for electronic components, providing efficient cooling and helping enhance the reliability of electronic components. In this article, we will explore the application field and working principles of this product.

Application Field of ATS-04F-10-C2-R0

The ATS-04F-10-C2-R0 is a small, entry-level heat sink that is suitable for cooling 27-44W semiconductor components. This includes components such as IGBT modules, MOSFETs, and thyristors. The product is also suitable for a range of eletronics, appliances and other equipment. It has an overall face size of 2.36 X 3.15 inches, making it ideal for small to medium-sized applications.

The ATS-04F-10-C2-R0 heat sink is designed with a wide range of features, such as dual wall construction, allowing for efficient heat transfer. The components are made of aluminum to ensure long-term reliability. The ATS-04F-10-C2-R0 is also available with a fan to further increase the cooling efficiency and maximize the life of the components being cooled.

Working Principle of ATS-04F-10-C2-R0

The ATS-04F-10-C2-R0 works by transferring thermal energy from the component being cooled to the air surrounding it. The heat sink\'s design features dual walls, which help to optimize the transfer of thermal energy. As the air passing over the fins of the heat sink carries away some of the heat energy, the remaining heat energy is transferred to other components in the system.

Additionally, the ATS-04F-10-C2-R0 can be equipped with a fan to maximize cooling efficiency. The fan works by drawing in cool air from the surrounding area and pushing it through the heat sink. This helps to quickly disperse the heat energy and cool down the components being cooled. The fan speed can be adjusted to meet the cooling needs of the system.

Benefits of ATS-04F-10-C2-R0

The ATS-04F-10-C2-R0 provides a range of benefits. Firstly, its small size gives it an edge over larger heat sinks, making it suitable for a wide range of applications. Secondly, its dual wall construction allows for efficient heat transfer, making it an ideal cooling solution for smaller electronic components. Thirdly, the product is available with a fan, which provides further cooling and maximizes the life of the components.

Overall, the ATS-04F-10-C2-R0 is a great solution for thermal management. Its efficient cooling helps to protect components from damage from thermal shock, and its small size means it can be used for a range of applications. The added fan increases cooling efficiency and makes the product suitable for more demanding applications.

The specific data is subject to PDF, and the above content is for reference

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