| Allicdata Part #: | ATS-04F-100-C1-R0-ND |
| Manufacturer Part#: |
ATS-04F-100-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-100-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-04F-100-C1-R0 application field and working principle
ATS-04F-100-C1-R0 thermal heat sinks are an important part of electronics cooling and heat transfer systems. Heat sinks are used for improving the performance, reliability, and life span of many products by preventing damage to electronic components caused by excessive temperatures.
Heat is created as a by-product of the electron flow in electrical components. Heat sinks are used to transfer this heat away from the components and dissipate it into the surrounding atmosphere. Heat sinks come in many shapes, sizes, and designs in order to meet the specific needs of a variety of applications.
The ATS-04F-100-C1-R0 heat sink is designed for use in a variety of applications including communications equipment, industrial controllers, laptops, personal computers, and many consumer electronics and industrial systems. The ATS-04F-100-C1-R0 heat sink is capable of cooling components under the most extreme conditions, including high temperatures, shock, and vibration.
The ATS-04F-100-C1-R0 thermal heat sink is composed of a base and fin assembly. The heat sink base is typically made of copper, aluminum, or a combination of these materials and is designed to provide the highest level of thermal conductivity. The fin assembly is made of either extruded or stamped aluminum and is designed to maximize heat transfer from the base to the fins, where air can help dissipate the heat.
The ATS-04F-100-C1-R0 heat sink also incorporates a highly conductive thermal adhesive that improves the overall thermal performance of the heat sink, and helps the thermal performance to remain consistent over a variety of temperature and humidity ranges. The adhesive also helps the heat sink to be more efficient in the transfer of heat away from the component.
The ATS-04F-100-C1-R0 heat sink is typically mounted on the component that requires cooling using thermal grease, springs, or screws. The heat sink is then connected to a fan or other cooling device which serves to blow or pull air past the heat sink, dispersing the heat away from the component. This fan and the heat sink work together to regulate the temperature and protect the component from overheating.
The ATS-04F-100-C1-R0 thermal heat sink is an affordable and efficient way to protect components from possible overheating caused by high temperatures, shock, and vibration. This type of heat sink is designed to improve the performance, longevity, and reliability of consumer electronics and industrial systems and is capable of cooling components under extreme conditions.
The specific data is subject to PDF, and the above content is for reference