ATS-04F-101-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.67°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-04F-101-C1-R0 is a high-quality thermal heat sink that offers excellent thermal management solutions. It is a superior solution for improving the efficiency of electronics systems, providing superior thermal performance and reliability. It is specifically designed for use in computers, network devices, telecommunications equipment, and more. It provides efficient heat dissipation to cooling components and keeps vital components at an optimum temperature. This thermal heat sink is a great choice for thermal and electronic performance in a variety of applications.

Design

The ATS-04F-101-C1-R0 is a solid-state thermal heat sink, containing a fin array and round body. The fin array is composed of aluminum shapes, with a high surface area of more than 400 cm2, enabling higher airflow and heat transfer efficiency. The round body is made of copper, which offers superior heat dissipation, resulting in an efficient cooling solution. The solid-state design of the ATS-04F-101-C1-R0 eliminates the need for a fan, making installation and maintenance easier. It is available in a variety of shapes, sizes, and heights to meet the needs of different applications.

Application Field

The ATS-04F-101-C1-R0 is suitable for a wide range of applications, including computer motherboards, high-end gaming systems, servers, power supplies, workstations, and industrial electronics. It is suitable for integration into existing systems, as well as for design into new systems. The design of the ATS-04F-101-C1-R0 allows it to be integrated into home theater systems, eliminating the need for an additional cooling system.

Working Principle

The ATS-04F-101-C1-R0 uses a combination of heat transfer and air convection to dissipate heat from the system. The large aluminum fins of the heat sink create a large surface area, allowing for maximum airflow. The round shape and solid construction of the ATS-04F-101-C1-R0 enable it to fit into tight spaces, reducing the space required for cooling. Heat is actively pulled away from the source by the fins, allowing for more efficient cooling. Airflow is an important factor in the cooling process. The ATS-04F-101-C1-R0 is designed to be used with heat sinks that utilize forced air cooling, such as fans or blowers. Airflow is then directed across the heat sink to effectively and efficiently dissipate the heat away from the system.

Conclusion

The ATS-04F-101-C1-R0 Thermal Heat Sink is an ideal solution for superior thermal performance and reliability in a variety of electronic systems. Its round shape and solid construction make it easy to integrate into existing systems and design into new ones. The high surface area of the fin array and the efficient airflow capabilities enable this thermal heat sink to effectively and efficiently dissipate heat away from the system. The ATS-04F-101-C1-R0 has become a popular choice for efficient cooling and reliable thermal performance.

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