| Allicdata Part #: | ATS-04F-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-04F-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential element in the design and optimization of electronic circuits. Heat sinks help dissipate the heat generated by electronic components in order to maintain proper operation and performance. The ATS-04F-117-C1-R0 is a thermal heat sink designed to provide thermal management for high power applications.
The ATS-04F-117-C1-R0 heat sink is a conduction-cooled, low thermal impedance aluminum cooling rack. It is constructed from intumescent-coated aluminum extrusions and fasteners. The heat sink features a four-level cooling profile that has been optimized to provide maximum thermal performance in a variety of circuits and power levels. The multiple levels provide more surface area to dissipate the heat faster. The fins are also angled downwards to provide increased surface area for cooling. The heat sink has been designed to provide the most efficient cooling possible, while providing thermal protection against unexpected thermal overloads.
The ATS-04F-117-C1-R0 heat sink is designed to be used in a variety of applications including power supplies, amplifiers, radiofrequency (RF) and microwave devices, x-ray penetrators and electrostatic machine tools. It is also suitable for use in DC-DC converters, high wattage LED lighting and other high-powered electronic devices. This thermal heat sink is also capable of providing thermal management for high-power systems such as those used in telecommunications, factory automation and vehicle-mounted electronics.
The working principle of the ATS-04F-117-C1-R0 heat sink is based on conduction heat transfer. When heat is generated by the electronic components, it is conducted through the heat sink material to the fins where it is dissipated into the environment. The higher the thermal resistance of the heat sink, the more heat is dissipated into the environment, thus maintaining the temperature of the components. The fins on the heat sink are also designed to induce air flow, creating a forced convection effect, which helps to further dissipate the heat.
In order to maximize the thermal performance of the ATS-04F-117-C1-R0 heat sink, the user should ensure that there is adequate clearance between the heat sink and the electronic components. It is also important to ensure that the heat sink is properly mounted and free of obstructions to ensure that the air flow is not restricted.
The ATS-04F-117-C1-R0 heat sink is a high-quality thermal management product that provides reliable and effective thermal management for high power applications. It is designed to provide an efficient cooling solution for a variety of circuits and power levels. It offers the user a cost-effective thermal solution that is easy to install and maintain.
The specific data is subject to PDF, and the above content is for reference