ATS-04F-134-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.44°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

The ATS-04F-134-C2-R0 is a high-performance thermal-heat sink designed to meet the needs of high-end computer applications. It is primarily used for cooling high-performance computer components such as processors, memory, and other electronic overheating elements. It has an impressive combination of excellent thermal performance and compact size. This makes it an ideal cooling solution for extreme computing platforms.

Design

The ATS-04F-134-C2-R0 is a two-piece design. The first piece is a large aluminum plate which has anodized surfaces to increase surface smoothness. The second piece is a heat sink which contains a series of grooves that help to dissipate heat from the computer components at higher temperatures. The aluminum plate is held firmly against the components by four screws. The aluminum plate also has a thermal pad between it and the heat sink that allows for better heat distribution.

Applications

The ATS-04F-134-C2-R0 is designed to work on high-end computer systems such as gaming PCs, workstations, and servers. It is ideal for cooling components with high thermal demands such as processors and memory. It can also be used to cool digital circuit boards as well as storage devices.

Working Principle

The working principle of the ATS-04F-134-C2-R0 is based on the heat sink’s ability to dissipate heat away from hot components. As heat is generated, it is absorbed by the thermal pad between the heat sink and the aluminum plate. The heat is then dissipated by the grooves in the heat sink. This keeps the temperature of the components at a safe level. The heat is further dissipated by the fans on the system. This combination of heat sink and fans ensure that the temperature of the components is kept within safe operating temperatures.

Conclusion

The ATS-04F-134-C2-R0 is an excellent thermal-heat sink designed to meet the needs of high-end computer applications. It has an impressive combination of excellent thermal performance and compact size. It is designed to work on high-end computer systems such as gaming PCs, workstations, and servers. The working principle of the heat sink is based on its ability to dissipate heat away from hot components and keep them at safe operating temperatures. This makes it an ideal cooling solution for extreme computing platforms.

The specific data is subject to PDF, and the above content is for reference