| Allicdata Part #: | ATS-04F-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-04F-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are thermal components designed to increase the rate of heat transfer from a device\'s surface to the surrounding environment. Heat sinks are commonly used in electronic devices, such as computers, laptops, and other electronics, to dissipate heat generated by the electronics. The purpose of heat sinks is to manage heat and prevent the device from overheating.
The ATS-04F-153-C1-R0 Heat Sink is one type of heat sink that is designed to be used in a variety of applications. This device is designed to provide an efficient and reliable way to dissipate heat from the surface of many electronic components, including heat-generation components, such as CPUs. It has a low profile, flat base design that makes it easy to install and use on uneven surfaces. It is also designed to offer a high level of thermal performance, with an extended operating temperature range from 0°C to 120°C.
The ATS-04F-153-C1-R0 Heat Sink is designed with an innovative natural convection cooling system. This cooling system effectively dissipates heat from the surface of the device by transferring the heat away from the surface and into the surrounding environment. In order to ensure optimal heat transfer, the ATS-04F- 153-C1-R0 Heat Sink features a large aluminum fin area and a smooth surface finish that enables air to flow freely and efficiently around the surface of the device.
The ATS-04F-153-C1-R0 Heat Sink also features an advanced fin design and a wide range of mounting options to accommodate a variety of applications. The device can be easily mounted with either screws or clips, making it easy to install and replace. The Heat Sink also features an integrated thermal pad that helps to provide excellent thermal interface between the Heat Sink and the component it is cooling.
In addition, this Heat Sink has a wide range of applications, and is ideal for cooling electronic components, including CPUs, GPUs, DDR2 modules, and power components, in a range of applications, including servers, workstations, automotive electronics, and other industrial and consumer applications.
The ATS-04F-153-C1-R0 Heat Sink is a cost-effective solution for managing heat and preventing electronic components from overheating. This Heat Sink is easy to install and replace, and offers a high level of performance. It is the perfect choice for a variety of applications looking for reliable and efficient cooling solutions.
The specific data is subject to PDF, and the above content is for reference