| Allicdata Part #: | ATS-04F-17-C1-R0-ND |
| Manufacturer Part#: |
ATS-04F-17-C1-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-17-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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：Thermal heatsinks are essential components of many electronic devices used today. ATS-04F-17-C1-R0 is a type of thermal-heat sink that is commonly used in a variety of applications. This article provides a brief overview of the ATS-04F-17-C1-R0 application field and working principle.
A heatsink is used to assist in the cooling of electronic components or systems. The ATS-04F-17-C1-R0 is a practical form of heat-sink that is typically used in applications such as robotics, industrial automation, and medical imaging. The heatsink is composed of a metal base that is coated with a layer of thermally conductive material that allows the heat to transfer from the components to the base. It is powered by an external heat source, typically either an electric fan or a Peltier device.
The ATS-04F-17-C1-R0 thermal-heat sink is designed to absorb, spread and dissipate heat produced by electronic components. It features a metal core and is designed to maximize surface area and deliver efficient heat dissipation. The metal core is also designed with a higher capacity for more efficient transfer and dissipation of heat. The surface of the heatsink is coated with a layer of thermally conductive material that is designed to provide optimal thermal performance while also providing higher efficiency. The metal surface of the sink also has a fan baffle to maximize the effectiveness of the fan, providing better cooling performance.
The ATS-04F-17-C1-R0 is also designed to be expandable for larger applications. The heatsink has multiple mounting holes which can be used to attach additional fans or other components. The thermal-heat sink has a high heat transfer rate, which helps to ensure that the system remains cool even under full load. Additionally, the heatsink can be mounted in a variety of ways, allowing the user to mount the sink in a variety of locations in order to better facilitate cooling.
The ATS-04F-17-C1-R0 is designed to be a reliable and efficient thermal-heat sink. It has a wide range of application fields, making it suitable for a variety of different configurations and applications. The heatsink is also designed to be a cost-effective solution for controlling and managing heat in electronic applications. It is designed to provide a balance between efficiency and cost-effectiveness, making it an ideal choice for a variety of thermal management solutions.
In conclusion, the ATS-04F-17-C1-R0 is a reliable and efficient thermal-heat sink that is designed to provide optimal cooling performance. It is suitable for a variety of applications and is designed to be cost-effective, making it an ideal choice for a range of thermal management solutions. The heatsink also has multiple mounting holes and is expandable, allowing users to customize their cooling setup to better suit their needs.
The specific data is subject to PDF, and the above content is for reference