| Allicdata Part #: | ATS-04F-18-C1-R0-ND |
| Manufacturer Part#: |
ATS-04F-18-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-18-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are devices used to disperse heat away from heat-generating objects such as processors, chips, and power amplifiers. An ATS-04F-18-C1-R0 heat sink is based on the principle of heat transfer, which is done through conduction. This type of heat sink uses aluminum as a thermal conductor. It has cooling fins, which provide a large surface area for heat dissipation. The size of the ATS-04F-18-C1-R0 heat sink also helps to reduce heat buildup in the components it is protecting.
The ATS-04F-18-C1-R0 heat sink is composed of three components. The first is the base plate, which is made of aluminum and serves as the thermal conductor. The second is the cooling fin, which is also made of aluminum and provides a large surface area for maximum heat dissipation. The third component is the top plate, which helps to securely attach the heat sink to the component it is cooling.
The ATS-04F-18-C1-R0 is designed for applications that require efficient cooling of high heat-generating components. The cooling fins and the aluminum material provide good heat-dispersing capabilities. It is typically used for cooling processors, chips, and power amplifiers. Since the ATS-04F-18-C1-R0 is a sealed heat sink, it has a superior thermal resistance, which helps to protect the components it is cooling from damage by reducing heat buildup.
The working principle of the ATS-04F-18-C1-R0 heat sink is based on thermal conductivity. It uses the aluminum base plate and fins to disperse the heat away from the component. The heat is then dissipated through the large surface area of the fins. The top plate then helps to securely attach the heat sink to the component, thus ensuring maximum cooling efficiency.
The ATS-04F-18-C1-R0 is a cost-effective and efficient solution for cooling high-heat generating components. Its design features help to reduce heat buildup and protect the components from damage. Its low profile and easy installation make it ideal for various types of applications. The ATS-04F-18-C1-R0 is an ideal solution for those who need an efficient and cost-effective way to cool heat generating components.
The specific data is subject to PDF, and the above content is for reference