ATS-04F-180-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04F-180-C3-R0-ND

Manufacturer Part#:

ATS-04F-180-C3-R0

Price: $ 4.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04F-180-C3-R0 datasheetATS-04F-180-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.74787
30 +: $ 3.53934
50 +: $ 3.33119
100 +: $ 3.12304
250 +: $ 2.91483
500 +: $ 2.70663
1000 +: $ 2.65458
Stock 1000Can Ship Immediately
$ 4.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management systems are responsible for managing the heat output of a variety of electronic components, including processors, GPUs, and other electronics. ATS-04F-180-C3-R0 Heat Sinks are a type of thermal management system that utilizes passive cooling and airflow to dissipate heat. They are lightweight and provide effective cooling solutions for a variety of applications.

ATS-04F-180-C3-R0 Heat Sinks work by providing a large surface area through which heat can be transferred into the surrounding environment. Heat sinks are generally made of aluminum or copper, which is thermally efficient at dissipating heat. Heat sinks typically have a fin structure which allows for maximum surface area exposure and better heat transfer. In addition, they can have a variety of shapes to increase their effectiveness for different applications.

The main purpose of heat sinks is to reduce and limit the overall temperature of a component or system. As an increasing amount of energy is dissipated into the environment, the overall temperature of the component or system decreases. This type of thermal management prevents the system from overheating and keeps the device running at an optimal level. Heat sinks are commonly found in computers, laptops, smartphones, and other electronic devices.

ATS-04F-180-C3-R0 Heat Sinks are designed for a variety of applications. They are often used in consumer electronics, such as laptops, tablets, and smartphones, due to their lightweight and effective cooling capabilities. In addition, they are also commonly used in industrial applications, such as power supply systems, servers, and automotive systems. Heat sinks are also often used in aerospace applications, such as space ships and satellites.

As mentioned earlier, heat sinks are designed to dissipate heat into the surrounding environment. This is done through the process of conduction, which involves the transfer of heat from the heat source to the heat sink. Heat sinks generally have a large surface area, which allows for more efficient heat transfer. In addition, the size and shape of the heat sink can also affect its effectiveness.

Additionally, the material from which a heat sink is made will also play a role in its ability to dissipate heat. Aluminum and copper are thermally efficient materials that can effectively dissipate heat. In addition, ceramic materials and other conductive materials are also available that can be used in the construction of a heat sink.

ATS-04F-180-C3-R0 Heat Sinks offer effective cooling solutions for a variety of applications. They are lightweight and can provide effective heat dissipation, which can help keep electronic components or systems running at optimal levels. In addition, these heat sinks are also used in industrial, aerospace, and other applications that require efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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