ATS-04F-181-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal Heat Sinks and ATS-04F-181-C3-R0Thermal heat sinks are devices used to dissipate the heat generated by an electronic device or system. They are commonly used for cooling CPU, GPUs, and other electrical components in modern electronics. The purpose of using thermal heat sinks is to absorb the thermal energy from the device, allowing the internal temperature of the device to remain stable.The ATS-04F-181-C3-R0 is an example of a thermal heat sink. It is constructed of anodized aluminum and provides excellent thermal performance due to its large surface area, providing a large amount of surface area for the heat to travel through. In addition, the ATS-04F-181-C3-R0 features a low-contact design which helps to reduce heat loss and ensures that the thermal energy is efficiently dissipated.Application Field and Working Principle of ATS-04F-181-C3-R0The ATS-04F-181-C3-R0 is designed to be used in a variety of applications, from consumer electronics to industrial equipment. In general, its uses depend on the type of system or device in which it is installed. For example, it can be used to cool down CPUs, GPUs, memory chips, memories, and other electronic components. It can also be used to provide cooling and thermal protection in industrial and commercial settings.The ATS-04F-181-C3-R0 works on the principle of thermal conduction. The heat generated by the system is absorbed by the heat sink and is then dissipated via thermal conduction processes. The aluminum body of the heat sink acts as an efficient conductor, and its large surface area allows the heat to be quickly dissipated. In addition, the design of the heat sink helps to ensure that the thermal energy is spread evenly and efficiently across the entire surface, ensuring that the internal temperature of the system remains stable.Benefits of Thermal Heat Sinks and ATS-04F-181-C3-R0The primary benefit of thermal heat sinks is their ability to ensure that the internal temperature of a system or device remains stable. By dissipating the heat generated by the system, heat sinks are able to prolong the lifespan of the device or system, as well as ensuring that the device or system performs reliably.The ATS-04F-181-C3-R0 provides a number of additional benefits, including its low-contact design which helps to reduce heat loss, and its large surface area which helps to ensure that the heat is dispersed evenly and efficiently. In addition, its aluminum body helps to ensure that the thermal energy is conducted away from the system quickly and efficiently.ConclusionThermal heat sinks are an essential component of any modern electronic system or device, as they help to ensure that the internal temperature remains stable. The ATS-04F-181-C3-R0 is an excellent example of a thermal heat sink, as it features a low-contact design, is constructed of anodized aluminum, and provides an impressive level of thermal performance due to its large surface area. In addition, its design helps to ensure that the thermal energy is spread evenly and efficiently, while its aluminum body ensures that the thermal energy is conducted away from the system quickly and efficiently.

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