| Allicdata Part #: | ATS8501-ND |
| Manufacturer Part#: |
ATS-04F-199-C2-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X6MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-199-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.52170 |
| 10 +: | $ 3.42405 |
| 25 +: | $ 3.23366 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.83°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-04F-299-C2-R0 is used primarily in thermal applications, most notably as heat sinks. Heat sinks are devices designed to transfer heat away from electrical components, providing more efficient cooling. The ATS-04F-299-C2-R0 is specifically designed to provide better heat transfer and better cooling than other thermal solutions.
The ATS-04F-299-C2-R0 features a unique design and high efficiency materials. The design utilizes a combination of air and conduction to dissipate heat. It has two large, flat copper surfaces on each side that are designed to maximize the surface area for heat transport. The ATS-04F-299-C2-R0 also features a wide array of thermal enhancements, such as vents, channels, and fins, to ensure the most efficient cooling.
The ATS-04F-299-C2-R0 is able to increase the cooling efficiency of any device by providing a greater surface area for heat transfer. The larger the surface area, the more efficient the transfer of heat. This is because the greater the surface area, the more room the heat has to escape to, and the faster it can dissipate. The improved heat transfer allows for a cooler running temperature, which can help reduce the risk of component failure.
The ATS-04F-299-C2-R0 is easy to install and requires minimal maintenance. The user simply needs to attach the device to the component and apply the appropriate amount of heat sink compound. The device then dissipates the heat from the component, allowing for better cooling overall. The ATS-04F-299-C2-R0 is also designed to be durable and long lasting, with a lifespan of up to ten years.
Overall, the ATS-04F-299-C2-R0 is an ideal solution for thermal applications. It offers superior heat transfer and cooling, and is easy to install and maintain. The device is also designed to be long lasting, providing reliable performance for years to come.
The specific data is subject to PDF, and the above content is for reference