ATS-04F-20-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal heat sinks are among the most important components to be used in electronic equipment, due to the need to regulate and remove excess heat. High temperatures can have an impact on the performance and life-span of electronic components, which can lead to components failing prematurely if adequate cooling solutions are not implemented. A Thermal - Heat Sink, like the ATS-04F-20-C2-R0, is designed to evenly dissipate heat from a component, drawing the heat away from it and into a device that can channel the heat away from the system. The key component of thermal heat sinks is fins – usually metal fins – that are arranged in a shape that optimises the thermal transfer. Usually, these fins are made from aluminum or copper, as these materials are highly effective conductors of thermal heat transfer, but other materials may also be used depending on the application. The metal fins draw the heat away from a component and then disperse it out into an area where it is quickly drawn away to maintain an overall cooling effect. The ATS-04F-20-C2-R0 is a special type of thermal heat sink which has an increased thermal capacity, making it well suited for applications in which large amounts of excess heat need to be dissipated. This is because the ATS-04F-20-C2-R0 features more and larger fins than other thermal heat sinks. As a result, the ATS-04F-20-C2-R0 is able to quickly dissipate larger volumes of heat than standard thermal heat sinks. In order to achieve maximum performance from the ATS-04F-20-C2-R0, an appropriate fan must also be fitted. The fan helps to draw the hot air away from the fins faster and more effectively by increasing the air flow across the heat sink assembly. This helps to reduce the temperature of the component, and extend the life-span of components and the equipment they are used in. In addition to improved cooling capabilities, the ATS-04F-20-C2-R0 has also been designed with reliability and durability in mind. Its construction features all metal components which are designed to last a long time, and to resist corrosion in harsh and demanding conditions. This makes the ATS-04F-20-C2-R0 well suited for use in industrial and laboratory applications which require reliable thermal heat sinks in order to maintain temperatures and prevent overheating. The ATS-04F-20-C2-R0 thermal heat sink is an advanced cooling solution for electronic components which requires a powerful cooling solution to maintain and optimise performance. Its larger heat dissipation capacity and all metal construction make it well suited for use in demanding environments as well as in everyday electronics applications.

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