ATS-04F-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04F-20-C3-R0-ND

Manufacturer Part#:

ATS-04F-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04F-20-C3-R0 datasheetATS-04F-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks is a form of dissipative technology used to speed up the cooling process of electronic components and systems, through the process of thermal conduction. They do this by transferring heat away from hot components and dissipating it into the immediate environment. The ATS-04F-20-C3-R0, developed by Aegis Technologies, is a fine example of this technology.

The ATS-04F-20-C3-R0 is a small, but efficient, heat sink that fits comfortably into any mini-ITX computer system or other small form factor devices. Its unique design makes it ideal for cooling even the highest performing CPUs, GPUs, and other components while producing minimal noise levels and low levels of waste heat. It is constructed from a combination of steel and aluminum, which helps it to dissipate heat quickly and efficiently.

The ATS-04F-20-C3-R0 uses a combination of heatsinks and heat pipes to deliver superior cooling performance. Heatsinks are used to absorb heat from the CPU and other components, and then dissipate it out into the ambient air. Heat pipes are used to transfer the heat from the heatsinks to a fan located on the side of the heat sink, which then forces the air out. Together, these two cooling methods help to reduce the CPU temperature, allowing higher levels of performance and longer life for your components.

The ATS-04F-20-C3-R0 features four independent heatpipes, which helps to evenly spread the heat between the heatsinks. The heatpipes use a special coating that increases the rate of heat transfer from the heatsinks, ensuring that heat is quickly dissipated into the environment. This improves cooling performance significantly, allowing for higher performance and extended component life.

In addition to its excellent cooling performance, the ATS-04F-20-C3-R0 is also incredibly easy to install. It fits easily into the standard PC mounts, with optional mounting brackets available for larger systems. It is also simple to connect to the rest of your system, with all the required wiring included in the package.

The ATS-04F-20-C3-R0 is an excellent choice for anyone looking for a reliable and efficient heatsink solution. Its combination of heatsinks and heat pipes effectively transfer heat away from components, eliminating waste heat and reducing the noise levels associated with normal air cooling methods. With its easy installation and impressive performance, the ATS-04F-20-C3-R0 is a great choice for anyone looking to keep their components running cool and silent.

The specific data is subject to PDF, and the above content is for reference

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