| Allicdata Part #: | ATS-04F-40-C1-R0-ND |
| Manufacturer Part#: |
ATS-04F-40-C1-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-04F-40-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a commonly used thermal management technique that can be used to reduce the temperature of devices, such as processors and transistors, and improve the longevity of electronic components. One type of heat sink is the ATS-04F-40-C1-R0, which is designed to provide cooling for high-power integrated circuits operating at temperatures up to 155°C. It is a fin-type heatsink that has a unique design that improves thermal dissipation.
The ATS-04F-40-C1-R0 is a finned heat sink made of extruded aluminum with an anodized black finish. It has a thermally conductive, highly thermally dissipative polymer that helps to reduce heat build-up and optimize cooling. The heat sink has two integrated heat pipes for maximum cooling efficiency, and the copper base helps to spread heat across the heatsink. The fins are optimized for airflow to ensure that the heat sink is capable of handling higher loads of heat. The ATS-04F-40-C1-R0 is designed to be used in devices such as power supplies, telecommunications devices, and other high-power applications.
In addition to its high thermal dissipation properties, the ATS-04F-40-C1-R0 also provides electrical insulation between the device and the heatsink. This electrical insulation prevents electrical leakage and short circuits that can cause system failure or failure of electrical components. As a result, the ATS-04F-40-C1-R0 is an effective way to manage heat and ensure reliability in high-power devices.
The ATS-04F-40-C1-R0 is the ideal thermal management solution for a variety of high-power applications. It is designed to reduce the temperature of devices, such as processors and transistors, and improve the longevity of electronic components. The heat sink also provides electrical insulation to protect against short circuits and electrical leakage, and its fin design optimizes airflow to ensure the device is capable of handling higher loads of heat. By combining its high thermal dissipation properties with electrical insulation, the ATS-04F-40-C1-R0 is the perfect choice for a variety of power applications.
The specific data is subject to PDF, and the above content is for reference
ATS-04F-40-C1-R0 Datasheet/PDF