ATS-04F-40-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04F-40-C1-R0-ND

Manufacturer Part#:

ATS-04F-40-C1-R0

Price: $ 5.85
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X11.43MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04F-40-C1-R0 datasheetATS-04F-40-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.26302
30 +: $ 4.97049
50 +: $ 4.67813
100 +: $ 4.38575
250 +: $ 4.09336
500 +: $ 3.80098
1000 +: $ 3.72789
Stock 1000Can Ship Immediately
$ 5.85
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.55°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are a commonly used thermal management technique that can be used to reduce the temperature of devices, such as processors and transistors, and improve the longevity of electronic components. One type of heat sink is the ATS-04F-40-C1-R0, which is designed to provide cooling for high-power integrated circuits operating at temperatures up to 155°C. It is a fin-type heatsink that has a unique design that improves thermal dissipation.

The ATS-04F-40-C1-R0 is a finned heat sink made of extruded aluminum with an anodized black finish. It has a thermally conductive, highly thermally dissipative polymer that helps to reduce heat build-up and optimize cooling. The heat sink has two integrated heat pipes for maximum cooling efficiency, and the copper base helps to spread heat across the heatsink. The fins are optimized for airflow to ensure that the heat sink is capable of handling higher loads of heat. The ATS-04F-40-C1-R0 is designed to be used in devices such as power supplies, telecommunications devices, and other high-power applications.

In addition to its high thermal dissipation properties, the ATS-04F-40-C1-R0 also provides electrical insulation between the device and the heatsink. This electrical insulation prevents electrical leakage and short circuits that can cause system failure or failure of electrical components. As a result, the ATS-04F-40-C1-R0 is an effective way to manage heat and ensure reliability in high-power devices.

The ATS-04F-40-C1-R0 is the ideal thermal management solution for a variety of high-power applications. It is designed to reduce the temperature of devices, such as processors and transistors, and improve the longevity of electronic components. The heat sink also provides electrical insulation to protect against short circuits and electrical leakage, and its fin design optimizes airflow to ensure the device is capable of handling higher loads of heat. By combining its high thermal dissipation properties with electrical insulation, the ATS-04F-40-C1-R0 is the perfect choice for a variety of power applications.

The specific data is subject to PDF, and the above content is for reference

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