
Allicdata Part #: | ATS8530-ND |
Manufacturer Part#: |
ATS-04F-49-C2-R0 |
Price: | $ 3.65 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X10MM L-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.32010 |
10 +: | $ 3.23379 |
25 +: | $ 3.14622 |
50 +: | $ 2.97133 |
100 +: | $ 2.79657 |
250 +: | $ 2.62181 |
500 +: | $ 2.53441 |
1000 +: | $ 2.27223 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 26.36°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are used to dissipate heat from small electronic device components, such as integrated circuits, and are excellent for cooling power supplies and other types of electronic devices. ATS-04F-49-C2-R0 thermal - heat sinks is an advanced thermal management solution that provides superior cooling capabilities with low power consumption. It is designed to dissipate significant amounts of heat efficiently from power supplies, lighting devices, power amplifiers, media players, and other consumer electronic products.
Design of ATS-04F-49-C2-R0 Thermal - Heat Sinks
The ATS-04F-49-C2-R0 thermal - heat sinks has a unique design that allows it to efficiently dissipate heat and maintain a steady temperature in electrical and electronic components. Its design consists of a shallow rectangular aluminum body that houses a ceramic component at the bottom. The ceramic component absorbs heat from the component and conducts it to the aluminum body, which dissipates the heat to the atmosphere. The aluminum body features several fins that increase the surface area, which further helps disperse heat.
The ATS-04F-49-C2-R0 thermal - heat sinks is designed to operate under high temperatures with maximum efficiency. Its high-efficiency design allows it to dissipate heat quickly and efficiently, enabling devices to operate at optimal performance levels. The device is constructed of lightweight aluminum with a low-profile design, making it an ideal choice for cooling systems where space is limited.
ATS-04F-49-C2-R0 Application Field and Working Principle
The ATS-04F-49-C2-R0 thermal - heat sinks is designed for use in consumer electronics, medical devices, aerospace, and other industries where thermal management is critical. It is an ideal choice for medical devices that need to maintain precise temperatures, as the device has a wide operational temperature range and its aluminum body dissipates heat quickly. The device is also suitable for consumer electronics such as DVD players, set-top boxes, media servers, video game consoles, and other components that require efficient cooling.
The ATS-04F-49-C2-R0 thermal - heat sinks works on a principle of dissipating heat by transferring it from the component to the body of the sink. The aluminum body of the sink conducts the heat to the fins, which create a larger surface area. The fins are designed to disperse the heat into the atmosphere, allowing the device to cool quickly and efficiently.
The device also comes with mounting clips, which allow it to be easily mounted to different surfaces. It is also designed to be compatible with a range of mounting solutions, which makes it an ideal choice for a variety of thermal management applications. Additionally, the device is designed to meet the stringent requirements of various safety and regulatory agencies, making it a safe and reliable option for cooling applications.
The ATS-04F-49-C2-R0 thermal - heat sinks offers an efficient and reliable solution for cooling various electronic components. Its unique design enables it to dissipate heat quickly and efficiently, allowing for optimal performance. The device is lightweight and easy to install, making it an ideal choice for cooling systems where space is limited.
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