| Allicdata Part #: | ATS-04F-50-C1-R0-ND |
| Manufacturer Part#: |
ATS-04F-50-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-50-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are cooling devices that are designed to help keep temperatures low when transferring large amounts of heat. The ATS-04F-50-C1-R0 is a thermal solution specifically designed for cooling electronics such as CPUs and integrated circuits. It is a thermal heat sink designed to offer superior thermal performance, minimal thermal resistance, and low stress on components.
The ATS-04F-50-C1-R0 is a sintered aluminum locking clip integrated heat sink designed for surface mounting on a printed circuit board (PCB). It is constructed from an innovative material combination of aluminum and other materials which offers high thermal performance for a wide range of applications. The heat sink uses a clamping pressure that is applied on the component to be cooled, resulting in a good contact with the PCB. This guarantees the optimal thermal spread between the component and the heat sink.
The ATS-04F-50-C1-R0 was designed for use in electronic devices with high power density components such as graphics cards, CPUs, and FPGAs. Its innovative design ensures that the thermal performance of these components is maintained at an optimal level. The heat sink can also be used in other applications that require additional thermal performance, such as power transformers, LED lighting systems, and electric motor cooling.
The working principle of the ATS-04F-50-C1-R0 is based on heat dissipation. Heat sinks are able to dissipate heat from the heat producing components by allowing air to flow through them, thus increasing the surface area for cooling and helping to reduce the overall temperature. The heat sink also utilizes a unique design that includes high volume copper fins, which are designed to dissipate more heat. The heat sink also has a locking clip integrated into its frame, which allows it to securely attach to the component for increased cooling efficiency.
In addition to its thermal dissipation capabilities, the ATS-04F-50-C1-R0 can also protect the components it cools from short circuits and other potential damage. The heat sink has an enhanced protection feature that will protect against the most extreme operating conditions. With its superior thermal performance and reliable construction, the ATS-04F-50-C1-R0 is an ideal solution for heat transfer and cooling of various electronic components.
The specific data is subject to PDF, and the above content is for reference