| Allicdata Part #: | ATS8531-ND |
| Manufacturer Part#: |
ATS-04F-50-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-50-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have long been incorporated into electronic systems to help maintain their temperature. The ATS-04F-50-C2-R0 is an example of such a device. It is a small form-factor heat sink, designed for use in applications where space is at a premium. It is capable of dissipating up to 50 watts of power, making it suitable for a wide range of applications.
The device is comprised of a copper base and aluminium fins arranged in a ‘V’ shape. This helps to maximise the surface area available for heat dissipation. The air extraction and extraction fins are designed to create an air curtain, further aiding heat dissipation. To allow for maximum heat dissipation, the fins are managed at two levels of effectiveness. The lower level fins are active when the device is operating in low temperature applications, while the higher level fins are activated when the temperature rises.
The device has two mounting options, one for vertical and one for horizontal installation. The vertical mount is designed for installations where the heat dissipation needs to be maximised, while the horizontal mount is best suited to applications where the device is used in a low temperature environment. The device also comes with a foam seal for clutter-free installation.
The ATS-04F-50-C2-R0 has a working principle which makes use of natural convection. This occurs when the heat generated by the system rises and is then dissipated into the fins. As the heat enters the fins, it is spread over their larger surface area and is then dispersed to the environment by natural convection. This reduces the temperature of the device, or of the system it is installed in, by reducing the thermal buildup.
The ATS-04F-50-C2-R0 has been designed to be used in a variety of electronic systems, including networking, mobile, automotive and industrial applications. Its small form factor allows it to be easily installed into cramped environments, while its thermal efficiency enables it to dissipate more heat in less space. This makes it an ideal choice for applications where temperature control is critical and space is at a premium.
In addition to its potential use in electronic systems, the ATS-04F-50-C2-R0 is also suitable for use in medical and telecommunication systems. In medical systems, where temperature control is essential, the device can provide reliable performance while ensuring minimal power usage. Similarly, in telecommunications systems, it can provide good thermal performance and reduce the overall power consumption.
The ATS-04F-50-C2-R0 is an effective heat sink designed for use in a wide range of applications. With its combination of small form factor and efficient working principle, it can provide great thermal performance without using excessive power, making it a great choice for those looking for a reliable and low-cost solution.
The specific data is subject to PDF, and the above content is for reference