ATS-04F-62-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04F-62-C1-R0-ND

Manufacturer Part#:

ATS-04F-62-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04F-62-C1-R0 datasheetATS-04F-62-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 16.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is increasingly becoming a critical component of electronic systems. Heat dissipation in electronic components can greatly reduce their reliability, life span and increase power consumption. As such, it is important to use the most efficient and effective thermal management solution available for any application. One of the most popular options available is the ATS-04F-62-C1-R0 heat sink which is designed to handle high-power, high-frequency applications. This article will explain how this heat sink works and the application fields which it is used in.

The ATS-04F-62-C1-R0 is an aluminum two-piece heat sink design which is suitable for high-power and high-frequency applications. The design incorporates several heat dissipation features which make it ideal for high temperatures and power levels. The first feature is the use of Aluminum Alloy 6063-T5 which offers excellent thermal conductivity and strength. The second feature is the fin design which has enhanced surface area and is optimized for low pressure differential. This allows for more heat dissipation to occur within the sink and thus greater heat transfer efficiency. The third feature is the use of a highly efficient die-cast aluminum mounting system which offers superior insulation and thermal stability.

The ATS-04F-62-C1-R0 heat sink is mainly used in applications where thermal management is essential. One example is within the telecommunications industry, where higher power levels can lead to significant temperature rises. The heat sink can be used to effectively manage the temperature of the circuits and components to ensure they remain within their safe temperature limits. Similarly, the heat sink is also suitable for applications within the automotive industry, where high levels of power are required, such as in high-performance engines. Using the ATS-04F-62-C1-R0 will allow the components to remain within their thermal limits, keeping them safe from damage.

The ATS-04F-62-C1-R0 has the ability to dissipate heat very effectively and is suitable for high power and high-frequency applications. In terms of working principle, the heat sink is designed with a two-piece heat sink design which provides superior thermal conductivity and enhanced surface area for heat dissipation. The design also includes an efficient die-cast aluminum mounting system to ensure that the heat sink is stable and highly insulated. This ensures that the heat sink is suitable for applications that require the highest levels of performance and reliability.

Overall, the ATS-04F-62-C1-R0 is an excellent choice for applications which require thermal management solutions.The design incorporates effective heat dissipation features which make it ideal for high temperatures and power levels. It is suitable for a variety of applications, such as within the telecommunications, automotive and high-performance commercial sectors. The heat sink is also able to provide superior thermal conductivity and stability, making it ideal for high power and high frequency applications. As such, applications which require reliable and efficient thermal management solutions should consider the ATS-04F-62-C1-R0 heat sink.

The specific data is subject to PDF, and the above content is for reference

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