| Allicdata Part #: | ATS-04F-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-04F-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-04F-73-C1-R0 thermal-heat sink device is designed to provide a cost-effective solution for cooling electronic components. It is a compact, lightweight device featuring a slim design for easy installation and minimal space. The device utilizes two tightly sealed aluminum plates to efficiently transfer heat away from the components and to the air. Its main purpose is to provide passive cooling to components, such as processors, which can increase the lifespan of the electronic components and decrease the risk of component failure or damage due to overheating.
The ATS-04F-73-C1-R0 is made up of two thin aluminum plates that are tightly sealed together. The top plate is designed with multiple small air vents to allow for air circulation and the bottom plate is designed to ensure that there is proper heat transfer from the component to the plates. The plates are thermally conductive and have been tested to withstand temperatures up to 120°C. The device also includes a high-quality, natural rubber gasket to ensure that no air leaks occur during operation.
The ATS-04F-73-C1-R0 thermal-heat sink device is easy to install and has a slim design making it suitable for a range of applications. It is perfect for applications such as processors, video cards, and LED lighting where excess heat needs to be effectively dissipated in a small space. It is also suitable for use in industrial applications, as it can provide effective cooling for very high heat loads.
In operation, the ATS-04F-73-C1-R0 operates by utilizing a fanless design to transfer heat away from the components and to the air. The air circulation is created by natural convection. This means that warm air is drawn into the vents on the top plate, and as it rises, is pulled through the system and out the sides. This process creates an efficient, continuous air flow within the device, allowing it to effectively reduce the temperature of the components.
The ATS-04F-73-C1-R0 thermal-heat sink device is an efficient and cost-effective solution for cooling electronic components. It is easy to install and is designed to be slim for easy installation into small spaces. It is also suitable for a range of applications due to its high-performance cooling capability and its ability to withstand high temperatures. This device is an excellent choice for those looking for an effective means of cooling their components and maintaining their performance.
The specific data is subject to PDF, and the above content is for reference