| Allicdata Part #: | ATS-04F-80-C3-R0-ND |
| Manufacturer Part#: |
ATS-04F-80-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04F-80-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an important component of managing heat in many different areas of industry, such as printer and computer hardware. ATS-04F-80-C3-R0 is a thermal - heat sink designed for computer applications. This product is specifically designed to manage heat in important components, like CPU chips, graphics chips, and RAM.
The ATS-04F-80-C3-R0 is a type of heat sink that is made up of multiple fins, arranged in a concentric circular pattern. The fins contain what are known as "micro-vias" -- tiny micro-excavations in the material that are used to enhance the overall heat transfer rate of the component. It is also available in a variety of sizes to suit different computer applications.
The ATS-04F-80-C3-R0 utilizes a unique thermal-heat sink design to provide maximum heat management performance. It works by cooling a hot primary surface via a thermal conduction process, moving the heat away from the CPU chip, graphics chip, and RAM in computer hardware. The micro-vias inside the heat sink are designed to create a highly efficient flow of air over the component, speeding up the rate of heat transfer. This helps to keep the entire system cool, and ensures that the components remain functioning optimally.
The ATS-04F-80-C3-R0 is one of the most efficient thermal-heat sinks available on the market today. It is made from high quality aluminum, which is an excellent conductor of heat. It is also designed to be highly durable, and is designed to last for many years in high temperature environments. Additionally, the product is designed to be lightweight, making it easy to install and move between computers.
The ATS-04F-80-C3-R0 is an ideal solution for those who need a reliable thermal-heat sink to reduce the risk of their computer or hardware systems overheating. Its high quality construction and superior ability to dissipate heat makes it one of the best heat sinks available. Furthermore, its low cost and lightweight design make it a great choice for those who want to save both time and money when managing their computer systems.
The specific data is subject to PDF, and the above content is for reference