ATS-04G-111-C1-R1

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Heat sinks are passive devices designed to aid in cooling by dissipating heat away from a system component, usually an integrated circuit, into its surrounding environment. The ATS-04G-111-C1-R1 is a thermal solution by Advanced Thermal Solutions, Inc. (ATS) that specializes in high performance heat sinks for advanced cooling applications. ATS-04G-111-C1-R1 employs natural convection to transfer heat away from an integrated circuit chip. Its fin design and structural form ensure efficient heat dissipation.

The ATS-04G-111-C1-R1 is designed to be used with single blockized integrated circuits such as power amplifier and voltage regulator integrated circuits. The heat sink is intended to be used in open airflow environments such that the external ambient temperature does not exceed the augmented temperature limit of the package. In order to provide a complete thermal solution, the product requires the use of a thermal interface material between the hot-surface on the component and the heat sink.

The size of the ATS-04G-111-C1-R1 is 110.9mm (L) x 50.0mm (W) x 116.0mm (H). Its construction is made of an extruded aluminum body with embedded copper fins. It features 6 mounting holes in a 4 corner configuration and it has a tapped hole in the center for mounting the integrated circuit chip. The heat sink has a thermal resistance of 0.93 °C/W when the integrated circuit is tested with a C-level steady state thermal resistance test.

ATS-04G-111-C1-R1 can be used in many applications that require thermal considerations. Examples include power amplifiers, voltage regulators, gate drivers, and direct current-to-direct current (DC-DC) step-up converters. Heat sinks should be considered when an integrated circuit is in a power dissipation range that exceeds the thermal capability of the device or system. Also, when the operating environment is in excessive temperatures or devices are installed in less than ideal orientation, then heat sinks may be needed.

The working principle of ATS-04G-111-C1-R1 is based on natural convection. The four mounting holes and tapped hole for integration circuits provide an ideal platform for a natural convection-based heat sink. Natural convection works by generating an air deck on the extruded aluminum extrusion, which flows across the fins, allowing for more efficient heat transfer out of the package. This process is repeated as hot air is drawn in from the bottom of the extrusion and is expelled from the top.

The natural convection not only helps transfer heat away from the component but also improves the thermal performance of the component. This process is achieved by cooling the heatsink from the bottom up rather than from the top down. By providing a large area for heat transfer, air decks are able to efficiently transfer heat from the component to the extruded aluminum, and then air is distributed outwards by the copper fins.

Furthermore, the ATS-04G-111-C1-R1 boasts an impressive thermal resistance rating of 0.93 °C/W. This is achieved by using the high thermal conductivity of aluminum and copper in the design. Furthermore, copper fins extend the surface area further and the air decks are able to exhaust hot air out of the system, further reducing overall temperatures. The combination of high thermal conductivity and effective air deck design boosts the overall performance of the heat sink.

The ATS-04G-111-C1-R1 is the perfect thermal solution for a wide array of applications. Its natural convection design allows for heat to be drawn away from components more efficiently and its impressive thermal characteristics effectively dissipate heat away from components. With exceptional performance and a compact build, the ATS-04G-111-C1-R1 is truly an ideal thermal solution for various cooling applications.

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