ATS-04G-117-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04G-117-C1-R0-ND

Manufacturer Part#:

ATS-04G-117-C1-R0

Price: $ 3.09
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04G-117-C1-R0 datasheetATS-04G-117-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.78208
30 +: $ 2.70669
50 +: $ 2.55629
100 +: $ 2.40591
250 +: $ 2.25553
500 +: $ 2.18034
1000 +: $ 1.95479
Stock 1000Can Ship Immediately
$ 3.09
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management of electronics is highly important in order to maintain proper working temperatures. One of the most efficient ways to dissipate heat from many types of processors and components is through the use of heat sinks. The ATS-04G-117-C1-R0 is a type of heat sink that is designed to dissipate large amounts of heat from one of the most important components in any system, the CPU.

The ATS-04G-117-C1-R0 is a passive cooling device, meaning that it does not require power or any other external means to dissipate heat. Its construction consists of a base made of aluminum and a set of fins. The base has multiple small holes in it, which helps to draw heat away from the CPU and into the surrounding atmosphere. The fins are made of copper or aluminum, and are designed to help reduce the surface area of the heat sink, which increases the thermal resistance between the heat sink and the CPU.

The primary application areas of the ATS-04G-117-C1-R0 are in laptops, servers and desktop computers. The heat sink is capable of dissipating up to 150W of CPU heat, making it ideal for use in high-performance systems. The heat sink is also compatible with a wide range of CPUs, including Intel Core i3, i5, i7, and Xeons. Additionally, it can be used to cool other components, such as video cards and memory.

The ATS-04G-117-C1-R0 works in the same way as other heat sinks do. Heat is drawn away from the CPU by the small holes in the base and then spread across the fins. As the heat moves across the fins, it is dissipated into the surrounding atmosphere, thus keeping the CPU from overheating. The heat sink is also designed to be extremely efficient in its thermal management capabilities, ensuring that the CPU remains cool even under heavy loads.

The ATS-04G-117-C1-R0 is an excellent choice for anyone looking to maintain the proper temperature of their CPU. It is an extremely efficient heat sink that is capable of dissipating a large amount of heat, making it ideal for high-performance computers. Additionally, it is compatible with a wide range of CPUs, making it a great choice for laptops, servers and desktop systems.

The specific data is subject to PDF, and the above content is for reference

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