ATS-04G-120-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS8613-ND

Manufacturer Part#:

ATS-04G-120-C2-R0

Price: $ 3.95
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04G-120-C2-R0 datasheetATS-04G-120-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.59100
10 +: $ 3.49335
25 +: $ 3.29918
50 +: $ 3.10502
100 +: $ 2.91098
250 +: $ 2.71691
500 +: $ 2.52285
1000 +: $ 2.47433
Stock 1000Can Ship Immediately
$ 3.95
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.48°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-04G-120-C2-R0 belongs to the category of thermal and heat sinks. It is a type of material designed to control heat produced in electronic systems. Heat sinks are often utilized in any system or device where there is a need to regulate temperature. This particular device is often found in avionics, missile systems, power supply drives, medical imaging, and industrial process controllers.

The ATS-04G-120-C2-R0 works by dissipating heat away from the processor, which makes it effective in preventing overheating from occurring. This device utilizes a special high performance, thermally conductive material to increase the efficiency of heat dissipation. The thickness of the thermal material varies based on the application and the dissipation needs of the system.

In order to ensure that the thermal material of the ATS-04G-120-C2-R0 is always functioning properly, it is important to regularly maintain it. This includes making sure that the material is free from any debris or dirt, and ensuring that the thermal interface material is at an optimal thickness. It is also important to ensure that the thermal insulation is securely attached to the processor.

The ATS-04G-120-C2-R0 is an effective and efficient way to regulate heat in most applications. It is designed to provide excellent thermal and mechanical performance, in order to keep the processor from overheating. The performance of the device is also dependant on the application in which it is used, as different systems require different levels of heat dissipation.

In addition, the ATS-04G-120-C2-R0 is designed to be low-profile, so that it can be mounted with minimal fuss. The device also includes an interposer, which allows it to easily fit between components, which increases the efficiency of the design. The materials used are also designed to be durable, so that they can withstand extreme temperatures and harsh environments.

Overall, the ATS-04G-120-C2-R0 is an excellent thermal and heat management device for a variety of applications. It is designed with durability and efficiency in mind, and its interposer ensures an efficient and reliable performance. The device is also easy to maintain and includes many features which enable it to be mounted with minimal effort. With its low-profile design, the device is an ideal choice for many applications where heat management is a concern.

The specific data is subject to PDF, and the above content is for reference

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