| Allicdata Part #: | ATS-04G-126-C1-R0-ND |
| Manufacturer Part#: |
ATS-04G-126-C1-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04G-126-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important design consideration for many types of electrical devices. Heat sinks allow manufacturers to evenly dissipate heat from sensitive components, which helps ensure reliable system operation. The ATS-04G-126-C1-R0 module is a type of heat sink that can be used to efficiently cool components with low power requirements.
This heat sink module is designed to provide optimized cooling for components with low to moderate power dissipation. It features a chassis-mounted aluminum alloy fin stack with optimized fin spacing, together with an effective coldplate which utilizes a unique bonding technique. This combination of materials and design ensures effective heat dissipation, even at low airflow rates. The fin stack is suitable for applications such as low-power heating elements, high-speed electronics and other components which require minimal thermal resistance.
The ATS-04G-126-C1-R0 heat sink module is capable of effectively cooling components with a wide range of power levels. It has an optimal thermal resistance of 0.015°C/W, with a maximum limit of 0.25°C/W. This allows it to be used in a wide range of applications, from low-power electronic components to high-power heating elements.
The working principle of the ATS-04G-126-C1-R0 heat sink is simple yet effective. The aluminum alloy fin stack dissipates heat through natural convection. As air passes through the fins, it absorbs the heat from the fin stack and takes it away from the components. The coldplate acts as a local heat sink, absorbing the heat from nearby components and redistributing it evenly throughout the fin stack.
The ATS-04G-126-C1-R0 heat sink module is ideal for a wide range of applications. Its optimized fin stack and coldplate make it suitable for low-power electronic components, while its high thermal performance makes it well suited for high-power heating elements. Its reliable and efficient cooling capabilities make it an ideal choice for any application requiring effective thermal management.
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