ATS-04G-153-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04G-153-C3-R0-ND

Manufacturer Part#:

ATS-04G-153-C3-R0

Price: $ 3.91
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04G-153-C3-R0 datasheetATS-04G-153-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.55131
30 +: $ 3.35370
50 +: $ 3.15643
100 +: $ 2.95917
250 +: $ 2.76189
500 +: $ 2.56462
1000 +: $ 2.51530
Stock 1000Can Ship Immediately
$ 3.91
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are essential components for controlling the temperature of electrical and electronic systems. The ATS-04G-153-C3-R0 is a common heat sink used in many applications due to its reliable operation. This article will discuss the application field of the ATS-04G-153-C3-R0 and its working principle.

Application Field

The primary application of the ATS-04G-153-C3-R0 thermal - heat sink is in integrated circuit applications. The heat sink is designed to dissipate thermal energy away from active electronic components such as CPUs, GPUs, and APUs. It is commonly used in industrial, automotive, aerospace, and consumer electronics where thermal management is critical.

The ATS-04G-153-C3-R0 is designed to be used on components that generate up to 35 W or less. This heat sink is capable of managing thermal loads in this range due to its optimized design. Its aluminum fins are structured in a particular way to maximize its surface area and its material properties allow it to efficiently dissipate heat.

The ATS-04G-153-C3-R0 is also popular in installations that require high levels of reliability. Its robust construction ensures that it can withstand harsh environments and provides a long operating life. It is UL recognized and is compliant with RoHS and REACH standards.

Working Principle

The ATS-04G-153-C3-R0 thermal - heat sink works by transferring the heat energy from the active components and dissipating it away from the system. It does this by employing a two-stage thermal transfer mechanism.

In the first stage, the heat energy is transferred from the active component through its heat conducting material, usually a combination of aluminium alloy and copper, to a large mass of aluminium fins. The fins are designed in an efficient manner to maximize the surface area for improved thermal transfer. This heat energy is then absorbed and dissipated away from the device into the surrounding atmosphere by convection.

In the second stage, a fan is used to accelerate the convective cooling process, further improving the heat dissipation rate. This additional cooling helps to make sure the device remains within its design temperature limits, preventing any potential thermal damage.

Conclusion

The ATS-04G-153-C3-R0 thermal - heat sink is a reliable and efficient thermal management solution for electronic and electrical systems. It is designed for use in applications that require reliable operation and is compliant with various safety standards. Its two-stage thermal transfer mechanism ensures that the heat energy of the active components is efficiently dissipated and the components remain within their design temperature limits.

The specific data is subject to PDF, and the above content is for reference

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