ATS-04G-173-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04G-173-C1-R0-ND

Manufacturer Part#:

ATS-04G-173-C1-R0

Price: $ 3.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X30MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04G-173-C1-R0 datasheetATS-04G-173-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.26907
30 +: $ 3.18087
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.68°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a crucial aspect of any electronic system. Heat sinks are essential components that allow heat to be dissipated from electronic systems to keep them running efficiently and safely. ATS-04G-173-C1-R0 heat sink is a cost-effective and reliable thermal management solution for various applications.

ATS-04G-173-C1-R0 is an aluminum extrusions with a clamshell design. This design helps dissipate heat effectively over a large area, while at the same time providing excellent thermal insulation. It is also lightweight and durable. Additionally, the heat sink can be easily installed and removed without any complicated tools or equipment. The heat sink is widely used in power supplies, computers, HVAC systems, consumer electronics, and telecommunications products.

The working principle of ATS-04G-173-C1-R0 is based on the three-dimensional heat transfer. Heat generated by the various components of the system is transferred to the heat sink by way of air convection. The Aluminum extrusion increases the surface area, allowing more heat to be dissipated. The clamshell design also serves as an excellent thermal conductor, allowing more efficient thermal transfer.

The ATS-04G-173-C1-R0 heat sink is a cost-effective and easy-to-install thermal solution. It is widely used in a variety of applications, and its excellent thermal management capabilities make it an ideal choice for many electronic systems. The heat sink offers excellent heat dissipation and excellent thermal insulation, and it can be easily installed and removed without requiring any special tools or equipment.

The specific data is subject to PDF, and the above content is for reference

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