| Allicdata Part #: | ATS-04G-173-C3-R0-ND |
| Manufacturer Part#: |
ATS-04G-173-C3-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04G-173-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44673 |
| 30 +: | $ 3.25542 |
| 50 +: | $ 3.06394 |
| 100 +: | $ 2.87242 |
| 250 +: | $ 2.68093 |
| 500 +: | $ 2.48943 |
| 1000 +: | $ 2.44156 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal technology has been around for many years, but recent advancements have revolutionized its use in today\'s modern world. One of the most recent innovations is the ATS-04G-173-C3-R0 thermal heat sink, which utilizes an optimized thermal design to provide superior cooling performance. The ATS-04G-173-C3-R0 offers excellent heat dissipation capabilities, making it well suited for applications that require a reliable cooling solution.
The ATS-04G-173-C3-R0 features a finned aluminum die cast housing with integrated side plates that are designed to provide better heat dissipation. The fins on the side plates help to maximize the surface area for the airflow. This helps to increase the cooling capacity, allowing the heat sink to dissipate heat more effectively and efficiently. The ATS-04G-173-C3-R0 also utilizes a high-performance thermally conductive coating to provide even better thermal transfer.
The ATS-04G-173-C3-R0 is designed to be compatible with a variety of air cooling solutions, including fans, vapor chambers, direct air cooling, and heat pipes. This allows it to be used in a wide variety of applications, including computers, industrial machinery, data centers, and other electronic devices. The heat sink is also designed to be compatible with a wide range of materials, including aluminium, copper, and even plastic.
The ATS-04G-173-C3-R0 utilizes its heated bimetal technology to provide efficient heat sink performance. The bimetal design utilizes two dissimilar metals with differing coefficients of thermal expansion to create a thermal switch. The thermal switch senses when the temperature of the device exceeds a predetermined level and triggers the heat sink to open, allowing the heat to dissipate into the surrounding air. This helps to maintain the optimal operating temperature of the device and prevent overheating.
The ATS-04G-173-C3-R0 is an excellent choice for applications that require reliable cooling and excellent thermal transfer. The optimized thermal design ensures that the heat sink is able to dissipate heat quickly and efficiently, helping to extend the lifespan of the device and improve its overall performance. Additionally, the heat sink is highly durable and can withstand extreme conditions. It is also designed to be compatible with a wide range of air cooling solutions, making it a great choice for any application.
The specific data is subject to PDF, and the above content is for reference