| Allicdata Part #: | ATS-04G-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-04G-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04G-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical factor in determining the reliability and performance of electronic devices. Heat sinks are used to transfer heat away from sensitive, often expensive, components or systems, typically using fans, conductive and convective cooling methods. Improper thermal management can lead to decreased longevity and efficiency, and at times even complete device failure. To prevent such problems, special thermal components such as ATS-04G-20-C3-R0 are designed.
The ATS-04G-20-C3-R0 is a high-end thermal product designed for use in a wide range of applications, such as telecom, networking, and instrumentation. It features a low-profile aluminum material for optimal heat transfer and uniform heat distribution. This product is designed and produced by Aluminium Corporation, an experienced and highly trusted manufacturer of thermal management solutions. The ATS-04G-20-C3-R0 features a lower cost compared to other thermal components yet offering reliable and consistent thermal results.
The ATS-04G-20-C3-R0 is a thermal device consisting of a heat sink and a fan. The heat sink is made of high-grade extruded aluminum, which dissipates heat efficiently. It is designed to be air-cooled with a fan and has fins through which air passes, cooling the heat sink and thus aiding in the heat transfer to the atmosphere. The fan is designed to provide adequate airflow to keep the heat sink cool. This combination of components works together to efficiently dissipate heat away from the system, resulting in improved performance and reliability.
The ATS-04G-20-C3-R0 is used in a variety of applications, including telecommunications systems, network devices, instrumentation, and other applications requiring a lower thermal profile component. It is designed to provide reliable performance, with superior heat transfer efficiency and long-term durability. It is also designed to be easy to install and maintain. The aluminum material used in the heat sink enables highly efficient thermal performance.
The primary purpose of the ATS-04G-20-C3-R0 is to provide reliable thermal management to preserve the life of the components or systems it is applied to. This thermal device effectively transfers heat away from the components or system it is applied to, thus providing improved reliability and efficiency. The combination of the heat sink and fan allows for improved cooling, resulting in improved performance and durability when it is used in the appropriate application.
The ATS-04G-20-C3-R0 is designed to provide reliable thermal management for a variety of applications. It features a low-profile aluminum material for optimal heat transfer and uniform heat distribution. The combination of the heat sink and fan allows for improved cooling. This product offers reliable thermal performance, making it an ideal choice for any application requiring efficient and dependable thermal management solutions.
The specific data is subject to PDF, and the above content is for reference