
Allicdata Part #: | ATS-04G-31-C1-R0-ND |
Manufacturer Part#: |
ATS-04G-31-C1-R0 |
Price: | $ 5.09 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 57.9X36.83X5.84MM |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.58073 |
30 +: | $ 4.32600 |
50 +: | $ 4.07156 |
100 +: | $ 3.81704 |
250 +: | $ 3.56257 |
500 +: | $ 3.30810 |
1000 +: | $ 3.24449 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.280" (57.90mm) |
Width: | 1.450" (36.83mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.230" (5.84mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 25.23°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-04G-31-C1-R0 Thermal - Heat Sinks APPLICATION FIELD AND WORKING PRINCIPLE
ATS-04G-31-C1-R0 is a thermal -heat sink type, which is widely used in various applications across industries. It is a reusable aluminum extrusion with passivated aluminum fins providing an effective heat transfer surface. The heat sink has a variety of advantages, particularly in terms of dissipating excessive heat and enabling efficient cooling of electronic devices.
The sheer variety of applications, from consumer electronics to industrial automation, where an ATS-04G-31-C1-R0 is used speaks volumes about its quality and effectiveness. This heat sink is used in servers, telecommunication equipment, automotive components, hybrid ITE accessories, medical diagnostic imaging, LED lighting display lamps, and gaming consoles.
The ATS-04G-31-C1-R0 heat sink contributes to the overall performance of electrical circuitry and cooling of electronic and other devices. It is typically used as part of an integrated heat dissipation system and works by taking in the device\'s excessive heated energy that is emitted by the operating system and dissipates it at a faster rate with natural convection. Consequently, it keeps the device at a stable temperature and prevents thermal stress or overloading.
The ATS-04G-31-C1-R0 heat sink works on the principle of natural convection; the efficient dissipation of heat is achieved through the combination of its hardware components and the natural flow of air. These components include the passivated aluminum extrusion, the aluminum fins, copper heatpipes, and impellers. The extrusion is designed to provide a large heat-exchanging area, whereby air naturally flows and moves across it.
This efficient heat transfer can be further enhanced by incorporating high-efficiency fans. The heat sink\'s natural convection capabilities can be further enhanced with advanced thermal pads and/or thermal grease which serve to optimally spread heat flow. As air passes over the aluminum fins its heat is dissipated, and the device itself remains cool. This basic principle ensures that devices can operate safely at optimal temperatures and conditions over time.
The ATS-04G-31-C1-R0 thermal-heat sink has been extensively tested and proven to provide significant additional heat dissipation benefits over traditional cooling solutions. In addition to its durability and superior heat dissipating capability, its design is highly compact and allows for installation within various tight spaces and confined areas. Its low manufacturing cost has ensured its ongoing popularity for use in cooling today\'s increasingly diverse and complex products.
Overall, the ATS-04G-31-C1-R0 thermal-heat sink is an essential component in cooling today\'s wide array of electronic devices. Its superior design provides superior heat dissipation over other solutions, allowing electronic devices to function optimally under all conditions while preventing thermal stress and overloading.
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