| Allicdata Part #: | ATS-04G-38-C3-R0-ND |
| Manufacturer Part#: |
ATS-04G-38-C3-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04G-38-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-04G-38-C3-R0 is a type of thermal-heat sink that is used to dissipate and keep an acceptable level of heat away from certain components or products. They are commonly used in a range of applications, from computers to consumer electronics. By selecting the right thermal-heat sink parameters, such as air flow, temperature, and cooling capacity, electronic components can be kept from overheating and failing.
The ATS-04G-38-C3-R0 is popular among many electronic component manufacturers because of its ability to take up a limited amount of space while still providing effective cooling performance. It is constructed from a copper base layer that is bonded to a secondary aluminum layer using adhesive. The structure of the thermal-heat sink is composed of multiple heat pipes that are arranged in a specific pattern and are filled with cooling liquid. The heat pipes, which are the most vital parts of the thermal-heat sink, are responsible for transferring the heat away from the component and dissipating it into the atmosphere.
When an electronic component or product is in operation, the thermal-heat sink works by transferring the heat away from the component and into the air via convection. This process is achieved by the use of a fan that helps move the air and create air flow which cools the component. The heat that is transferred is then dissipated into the environment. During this process, the air flow created by the fan helps to regulate the temperature of the component, ensuring that it doesn’t overheat. This helps to prevent electronic components or products from failing.
The ATS-04G-38-C3-R0 thermal-heat sink is effective at cooling components or products at extremely high temperatures. This is due to its innovative design that allows it to quickly and efficiently transfer heat away from the component and dissipate it into the atmosphere. The thermal-heat sink is also resistant to corrosion due to its durable construction, ensuring a longer lifespan for components and products.
The ATS-04G-38-C3-R0 is an ideal choice for cooling components or products in a variety of applications. It is capable of quickly and efficiently transferring heat away from components while still allowing for a small footprint in terms of space. With its robust construction, the ATS-04G-38-C3-R0 is a reliable choice for keeping components or products from overheating and failing.
The specific data is subject to PDF, and the above content is for reference