ATS-04G-44-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

The ATS-04G-44-C1-R0 is a heat sink designed to provide a fast and effective heat dissipation solution from a variety of electronic components. It is a top-of-the-line model that is designed with advanced thermal design principles to reduce the thermal resistance between the device and the ambient. Its size is relatively compact, so it can easily fit into small spaces.

Application Field

The ATS-04G-44-C1-R0 is ideal for applications such as: desktop computers, server systems, laptops, and other devices with high cooling requirements. This heat sink is designed for both commercial and industrial applications. It is also widely used as a dielectric material for power applications and for an efficient heat sink to maintain optimal thermal performance.

Working Principle

The ATS-04G-44-C1-R0 works in a variety of ways to transfer and dissipate heat. The heat sink is designed with a series of fin structures that create turbulence in the airflow around the heat sink. This turbulence creates better heat transfer between the cold air and the hot surface of the heat sink. This helps to reduce any hotspots on the surface of the device, which can lead to further thermal problems. The fins also create a greater surface area for heat to transfer and dissipate to the surrounding air.The heat sink also includes a series of heat pipes that are used to transfer the heat from the component to the heat sink. Heat pipes are efficient because they allow for a more uniform heat distribution across the heat sink, reducing the chances for hotspots. This can also help to reduce the thermal resistance between the device and the heat sink. The efficiency of the ATS-04G-44-C1-R0 heat sink is further enhanced by its ability to be integrated with other cooling components, such as a fan, to provide additional cooling power. This type of heat sink can also be used with a thermal compound to improve the thermal transfer. The thermal compound helps to fill any air gaps between the component and the heat sink, improving the efficiency of the heat transfer.

Conclusion

The ATS-04G-44-C1-R0 is a heat sink that is designed with advanced thermal design principles to provide an efficient and high-performance cooling solution. The heat sink is designed with several fin structures and heat pipes to provide better heat transfer and dissipation, and it can be integrated with other cooling components to provide additional cooling power. Additionally, it can be used with thermal compound to further improve its thermal transfer efficiency. This makes it an ideal heat sink for a variety of devices with high cooling requirements.

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