| Allicdata Part #: | ATS-04G-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-04G-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04G-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a form of thermal management that allow devices to remain cool and safe for use. ATS-04G-65-C3-R0 is a product of heat sink specifically designed for applications such as overclocking and power control. In this article, we will discuss the application field and working principle of the ATS-04G-65-C3-R0 heat sink.
Application Field
The ATS-04G-65-C3-R0 heat sink is designed for applications such as overclocking and power control, which require a reliable thermal management solution. It's compatible with both Intel and AMD CPUs, and is capable of operating at temperatures ranging from -55 to +125 degrees Celsius. With the high-performance thermal interface material, it ensures perfect contact between the CPU and the heat sink, and can also effectively reduce the thermal contact resistance. This allows for better heat dissipation, thus ensuring more stable performance.
The ATS-04G-65-C3-R0 heat sink is ideal for overclocking and power control in both gaming PCs and workstations. It has a robust construction, providing an excellent surface mining ratio and low thermal resistance, making it perfect for stable high-power operation. As it has a high resistance to corrosion, it also helps prevent damage to the CPU in the long run.
Working Principle
The ATS-04G-65-C3-R0 heat sink works by using a combination of convection cooling and conduction cooling to transfer the heat from the CPU to the atmosphere. Firstly, the air between the radiator fins will be heated up by the CPU, then the hot air will rise, get cooled down by cooler air, then fall and ultimately be exhausted into the atmosphere. The continuous circulation of the air helps in effectively dissipating the heat from the CPU.
Furthermore, conduction cooling is also used to transfer heat. This is due to the thermal interface material that is inserted between the CPU and the heat sink. As the CPU heat transfers to the heat sink, the thermal interface material, which acts as an insulator, ensures that the heat is not transferred back to the CPU but instead, to the radiator fins. The radiator fins then dissipate the heat into the atmosphere.
The ATS-04G-65-C3-R0 heat sink is an effective hybrid thermal management solution that combines both convection and conduction cooling. It is specifically designed for those applications that require reliable thermal management such as overclocking and power control. It ensures excellent heat dissipation, and is resistant to corrosion, thus providing protection to the CPU in the long run.
The specific data is subject to PDF, and the above content is for reference