Allicdata Part #: | ATS-04G-75-C3-R0-ND |
Manufacturer Part#: |
ATS-04G-75-C3-R0 |
Price: | $ 3.44 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-04G-75-C3-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.12669 |
30 +: | $ 3.04206 |
50 +: | $ 2.87305 |
100 +: | $ 2.70409 |
250 +: | $ 2.53507 |
500 +: | $ 2.45056 |
1000 +: | $ 2.19705 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks are an integral part of modern electronic systems. They provide a method of cooling components operating at high temperatures in order to prevent and reduce heat damage. The ATS-04G-75-C3-R0 is a popular type of thermal-heat sink that is frequently used in a wide array of applications. This article will provide a brief overview of the ATS-04G-75-C3-R0 application fields and its working principle.
The ATS-04G-75-C3-R0 is a aluminium-based thermal-heat sink that is comprised of a finned base and an array of closely-spaced vertical columns. It is designed for use in high-frequency applications, where it can handle a wide range of temperatures, from -40°C to +150°C. This thermal-heat sink is primarily used in LED modules, server systems, telecom equipment, and military systems. In addition, it is suitable for a low profile design, as it has a slim form factor and a mounting system that is adaptable to different sized PCBs and equipment.
The ATS-04G-75-C3-R0 works by absorbing, storing, and dissipating heat from components. It has a large surface area consisting of multiple columns. The heat from the components enters the columns of the heat sink, where it is absorbed and transferred in multiple directions throughout the columns. Once the heat is transferred, it is released out of the back wall through the heat sink.
The ATS-04G-75-C3-R0 has an enhanced heat sink design that provides superior heat transfer capabilities. It features a four-way direct airflow, allowing the heat to be more evenly distributed across the surface of the heat sink. Additionally, the ATS-04G-75-C3-R0 has a Multi-PathTM technology that ensures maximum heat absorption and transfer to the sink’s surface, providing improved efficiency and an extended service life.
In addition to the features described above, the ATS-04G-75-C3-R0 boasts a number of advantages. It has a rugged design that is resistant to shock and vibration, making it suitable for use in rough environments. Moreover, it is low-cost and highly efficient, making it ideal for many different applications. Furthermore, it has a highly reliable operation that is suitable for a wide variety of demanding applications.
Overall, the ATS-04G-75-C3-R0 is a reliable and highly efficient thermal-heat sink. Its unique design allows it to efficiently transfer and dissipate heat from components, while its rugged construction makes it suitable for a wide array of applications. Furthermore, its efficiency and low cost make it a popular choice for many different uses. As such, the ATS-04G-75-C3-R0 is an ideal choice for those who are looking for a reliable and efficient thermal-heat sink solution.
The specific data is subject to PDF, and the above content is for reference