ATS-04G-80-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04G-80-C1-R0-ND

Manufacturer Part#:

ATS-04G-80-C1-R0

Price: $ 3.25
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04G-80-C1-R0 datasheetATS-04G-80-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.94840
30 +: $ 2.86860
50 +: $ 2.70925
100 +: $ 2.54986
250 +: $ 2.39047
500 +: $ 2.31079
1000 +: $ 2.07174
Stock 1000Can Ship Immediately
$ 3.25
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sinks are used to dissipate the heat that is generated by an electronic device and its components. Heat sinks work by transferring the heat away from the device and dispersing it evenly into the surrounding air. The ATS-04G-80-C1-R0 is a thermal heat sink solution designed for optimal thermal performance and is engineered for use in a variety of different applications. This article will provide a brief overview of the ATS-04G-80-C1-R0 application field and working principle.

Application Field

The ATS-04G-80-C1-R0 is designed for use in a variety of applications. It is ideally suited for high-powered, high-performance CPU/GPU cooling applications that require a high level of efficiency. This heat sink is also suitable for semiconductor device cooling, as well as electronic device and component cooling applications. It is designed for use in a range of environments including industrial, military, aerospace, automotive, marine, and more.

Working Principle

The ATS-04G-80-C1-R0 utilizes an unconventional design that enables exceptional thermal performance. It works by using a combination of thermal radiators and heat pipes that are strategically arranged to promote maximum transfer of heat away from the source. The heat pipes act as thermal bridges between the heat source and the radiators. This enables efficient heat transfer away from the heat source, and then dissipates it to the surrounding air.

The radiators are then designed with an aluminum base, which further enhances the thermal performance of the heat sink. The aluminum base material helps to dissipate the heat away from the device and evenly disperse it into the surrounding environment. This helps ensure optimal thermal performance and enhances the lifetime of the device it is cooling.

Conclusion

The ATS-04G-80-C1-R0 is a thermal heat sink solution designed for optimal thermal performance and is engineered for use in a variety of different applications. It works by using a combination of thermal radiators and heat pipes that are strategically arranged to promote maximum transfer of heat away from the source. Additionally, the aluminum base of the radiators ensures efficient heat transfer and even dissipation of the heat into the surrounding air. This ultimately ensures optimal thermal performance and enhances the lifetime of the device it is cooling.

The specific data is subject to PDF, and the above content is for reference

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