| Allicdata Part #: | ATS-04G-80-C3-R0-ND |
| Manufacturer Part#: |
ATS-04G-80-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04G-80-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The thermal - heat sinks are useful in a number of different applications, and the ATS-04G-80-C3-R0 is a great example of a thermal - heat sink. This heat sink is designed to help dissipate heat from components in electronic circuits. The ATS-04G-80-C3-R0 is an extruded aluminum heat sink with copper fins and is designed for maximum performance in applications where size and weight are important factors. The heat sink is designed to fit in various applications, such as microelectronics, telecommunications, and computer circuits.
The ATS-04G-80-C3-R0 uses a variety of advanced technologies to effectively dissipate heat from components in electronic circuits. The heat sink utilizes advanced fin geometry to ensure maximum surface area for efficient heat transfer. In addition, the heat sink is designed with an anodized finish that improves contact with other components for more efficient heat conduction. The heat sink also features an optimized airflow design that ensures maximum cooling efficiency.
The ATS-04G-80-C3-R0 works by dissipating heat that is generated from components in electronic circuits. When heat is generated, the heat is conducted from the component to the fins in the heat sink. The fins then dissipate the heat into the surrounding air. The heat is then dissipated into the surrounding air, providing a cooler environment for the components, which helps the components from being damaged due to excessive heat.
The ATS-04G-80-C3-R0 can be used in a wide variety of applications, including computers, audio components, telecommunications devices, and lasers. It is compatible with all types of components, including transistors, diodes, LEDs, and ASICs. The heat sink is also highly resistant to corrosion, making it suitable for use in harsh environmental conditions. The ATS-04G-80-C3-R0 can be mounted on a variety of surfaces, including board-level devices, heat enclosures, and printed circuit boards.
The ATS-04G-80-C3-R0 is a great solution for dissipating heat from components in electronic circuits. Its advanced fin geometry and anodized finish, combined with its optimized airflow design, make it an ideal solution for high-performance applications where size and weight are important factors. It is highly resistant to corrosion, making it suitable for use in a variety of applications and harsh environmental conditions. Furthermore, it can be mounted on a variety of surfaces, making it a great choice for many different types of applications.
The specific data is subject to PDF, and the above content is for reference