| Allicdata Part #: | ATS-04H-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-04H-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential for many electronic products, and heat sinks are common components used to keep devices cool and running efficiently. The ATS-04H-02-C3-R0 is a thermal management solution designed for high power applications, offering excellent performance in a low cost package.
The ATS-04H-02-C3-R0 is designed for use in a wide range of applications, from medical and industrial equipment to power supplies and data processing systems. In addition to its thermal performance, it also offers easy assembly and a slim profile, allowing it to fit into tight spaces. This makes it ideal for applications where space is limited.
The ATS-04H-02-C3-R0 is designed to be used with a variety of cooling systems, from forced-air fans to liquid cooling systems. It utilizes an extended fin technology, which offers increased surface area and improved heat transfer, and a stainless steel subframe, which improves the structural integrity of the heat sink. This design provides an efficient cooling solution for high power applications.
The ATS-04H-02-C3-R0 is a compact and low-profile heat sink that offers excellent performance in a variety of applications. The extended fin technology provides increased surface area for improved heat transfer and the stainless steel subframe improves the structural integrity of the heat sink. In addition, the slim profile of the heat sink allows it to be used in tight spaces, making it ideal for applications where space is limited.
To ensure performance and reliability, the ATS-04H-02-C3-R0 is constructed using premium materials. A heat transfer pad is used to improve heat transfer between the heat source and the heat sink, and a dissipative polymer construction ensures superior thermal resistance. The heat sink is also certified to meet UL, CE, and RoHS safety standards.
The ATS-04H-02-C3-R0 is designed to work with a variety of cooling systems, from forced-air fans to liquid cooling systems. It utilizes a combination of convection and conduction cooling, which provide an efficient cooling solution for high powered applications. The heat sink’s extended fin technology also helps to improve the heat transfer rate, providing better thermal management and cooling.
In conclusion, the ATS-04H-02-C3-R0 is an excellent thermal management solution designed for high power applications. The heat sink’s extended fin technology provides increased surface area and improved heat transfer, and its slim profile makes it ideal for use in tight spaces. Constructed from premium materials, the ATS-04H-02-C3-R0 is certified to meet UL, CE, and RoHS safety standards, and is designed to work with a variety of cooling systems. The ATS-04H-02-C3-R0 is the perfect thermal solution for your needs.
The specific data is subject to PDF, and the above content is for reference