| Allicdata Part #: | ATS-04H-12-C1-R0-ND |
| Manufacturer Part#: |
ATS-04H-12-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-12-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-04H-12-C1-R0 is a thermal – heat sink designed for specific applications. Heat sinks absorb and dissipate heat, which is essential to the proper functioning of any electronic device. Heat sinks are designed to cool processors, other electronic components, and protect against electrical damage. This type of heat sink consists of two parts, a base and a plate. The base is made of aluminum, while the plate is copper. The plate is attached to the base by means of four screws.
The ATS-04H-12-C1-R0 thermal – heat sink has a total height of 12 mm, and a width and length of 45x83 mm. It also features 4 mounting holes, allowing for easy mounting on an existing platform or circuit board. The heat sink is designed to provide optimal cooling performance. It is designed to provide rapid heat dissipation by increasing the surface area of the base and the plate. This allows for better heat transfer from the base and the plate to the surrounding environment. The fan on the heat sink also helps to draw cooler air from the outside of the device to the plate and base, increasing cooling performance.
The working principle of the ATS-04H-12-C1-R0 thermal – heat sink is relatively simple. When there is a build-up of heat, either from a processor or other electronic components, the heat is absorbed by the base and transferred to the plate. The plate then dissipates the heat from the device. The fan then draws in cooler air from the outside and dissipates it as well, thus reducing the temperature. The plate and base are carefully designed to provide optimal cooling performance and to keep unwanted heat from being generated.
The ATS-04H-12-C1-R0 thermal – heat sink can be used in many electronic applications where rapid heat dissipation is necessary. This heat sink is suitable for all types of processors, as well as for advanced Thermal Interface Materials (TIMs). As well, it can be used in high-end servers and datacenters to keep components cool and to prevent the risk of overheating. Other applications include but are not limited to LED lighting, telecoms, optical devices, and consumer electronics.
Overall, the ATS-04H-12-C1-R0 thermal – heat sink is an ideal solution for any application that requires rapid heat dissipation. Its design allows for optimal thermal performance, increased longevity, and protection of electronic components. With its low profile and fanless design, this heat sink provides a reliable and efficient cooling solution for any application.
The specific data is subject to PDF, and the above content is for reference