| Allicdata Part #: | ATS-04H-131-C1-R0-ND |
| Manufacturer Part#: |
ATS-04H-131-C1-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-131-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical for performance and reliability in electronic systems. Heat generated by high power components and systems needs to be spread out and dissipated in order for those components and systems to function properly. Heat sinks find wide application in consumer, industrial and commercial electronic equipment for heat dissipation and thermal management. The ATS-04H-131-C1-R0 heat sink is one such version, with an unique application field and working principle.
The ATS-04H-131-C1-R0 heat sink is a radial fin design with multiple pin arrays. It is made from the highest quality aluminum alloy, with a copper base and an integrated fan. It has been designed to meet the most demanding heat dissipation requirements. It is suitable for use in a variety of environments ranging from medical, scientific, and military applications, to consumer electronics. The ATS-04H-131-C1-R0 heat sink is also widely used in computers, gaming consoles and other high-performance applications.
The ATS-04H-131-C1-R0 heat sink works on the principle of forced convection cooling. The fan on the heat sink creates an airflow, which helps to remove the heat from the device it is mounted on. The hot air is then moved away from the heat sink via the fans, where it is then dissipated. The fan rotation speed can also be adjusted manually or automatically, depending on the cooling needs of the device.
The ATS-04H-131-C1-R0 heat sink is designed to be incredibly efficient, with its multiple pin arrays providing large surface area to quickly draw heat away from the device and its copper base providing excellent thermal conductivity for fast heat transfer to the radiator fins.
The ATS-04H-131-C1-R0 heat sink is a great solution for any thermal management need, and its numerous features make it an ideal choice for any environment. Its construction guarantees excellent thermal performance and long-term reliability, and can be used in a variety of applications.
The specific data is subject to PDF, and the above content is for reference