| Allicdata Part #: | ATS-04H-160-C3-R0-ND |
| Manufacturer Part#: |
ATS-04H-160-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-160-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a form of thermal management system designed to dissipate the heat from an electronic or mechanical device. The ATS-04H-160-C3-R0 is a thermal management system specifically designed for high-power applications such as computers and data centers. This system works by transferring the heat generated by the device to the ambient air, avoiding any damage to the device due to overheating.
The ATS-04H-160-C3-R0 is specifically designed to suit applications where a high power device is used. This includes applications such as computers, data centers, and other power electronics. As such, it is ideal for systems that generate a lot of heat, as it will be able to dissipate the heat quickly and efficiently.
The design of the ATS-04H-160-C3-R0 is based on a “sprint-style” heat sink. This design utilizes four separate heat dissipation sockets, which are arranged in a vertical line. The four sockets are connected to a frame made up of copper fins. These fins are designed to efficiently transfer the heat generated by the device to the air. The fins themselves are arranged in an alternating pattern, which increases their surface area and thus results in an increased rate of heat transfer.
In addition to its unique design, the ATS-04H-160-C3-R0 also utilizes a thermal tape system to ensure proper heat dissipation. The thermal tape works by creating an air gap between the device and the fins, thus allowing for more efficient heat transfer. It also acts as an insulator, preventing any heat generated by the device from escaping. This means that the ATS-04H-160-C3-R0 is able to dissipate a great amount of heat without damaging the surrounding components.
The ATS-04H-160-C3-R0 is also designed with noise reduction in mind. The fins are angled in such a way that they prevent noise from escaping. The air gap created by the thermal tape also helps to reduce the noise emitted by the device. Additionally, the fins are hollow which allows air to flow freely through them, thus reducing the noise further.
Overall, the ATS-04H-160-C3-R0 is an effective and efficient thermal management system suitable for high power applications such as computers and data centers. It utilizes an innovative design, combining heat dissipation sockets and a copper fin frame in order to maximize heat transfer. Additionally, its thermal tape system and noise reduction capabilities ensure that the device runs at its optimal temperatures without causing any harm to the surrounding components. Therefore, if you are in need of a reliable and efficient thermal management system, the ATS-04H-160-C3-R0 is a great choice.
The specific data is subject to PDF, and the above content is for reference