| Allicdata Part #: | ATS8862-ND |
| Manufacturer Part#: |
ATS-04H-167-C2-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-167-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.13740 |
| 10 +: | $ 3.05550 |
| 25 +: | $ 2.97259 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.10°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are used to dissipate heat away from surfaces that they are attached to in order to avoid or prevent overheating. They can be used to cool a variety of devices and components including processors, memory chips, power amplifiers, amplifiers, and many other electronics. Heat sinks are typically made of aluminum, copper, or other metal materials, but plastic and other thermoplastic materials can be used in certain cases. In addition to their heat dissipating properties, they also often provide additional support and stability to the device or component they are mounted to.
The ATS-04H-167-C2-R0 heat sink is a thermal solution that is designed to dissipate heat away from components such as processors, memory chips, power amplifiers, and other electronics. This heat sink has a cylindrical body with an aluminum fin that extends out from its base. The top portion of the heat sink is equipped with a fan that helps to increase air flow over the fins and further dissipates heat away from the component. The base of the heat sink is designed to fit on top of a PCB and can be secured with standoffs or other mounting hardware.
The working principle of the ATS-04H-167-C2-R0 heat sink is that it takes the heat generated by the component being cooled and transfers it away from the component via the heatsink’s fins and fan. The aluminum fin design of the heat sink provides maximum surface area for efficient heat dissipation. The fan helps to further increase air flow over the fins, allowing more heat to be dissipated from the component faster.
The ATS-04H-167-C2-R0 heat sink is designed for a variety of applications and is suitable for applications that require cooling of processors, memory chips, power amplifiers, amplifiers, and other electronics. It can be used to cool components in a wide range of industrial, commercial, and consumer electronics products. It can also be used in automotive and military applications. Additionally, this heat sink can be used as part of a system to dissipate any excess heat generated from components such as processors, memory chips, and power amplifiers.
In conclusion, the ATS-04H-167-C2-R0 heat sink is a thermal solution designed to dissipate heat away from components such as processors, memory chips, power amplifiers, and other electronics. It uses an aluminum fin design to maximize surface area for efficient heat dissipation and a fan that helps to increase air flow over the fins. This heat sink can be used for a wide range of industrial, commercial, and consumer electronics applications. It can also be used in automotive and military applications and to dissipate any excess heat generated from components like processors, memory chips, and power amplifiers.
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