| Allicdata Part #: | ATS-04H-168-C1-R0-ND |
| Manufacturer Part#: |
ATS-04H-168-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-168-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a great way to disperse heat away from valuable electronic components without the need for external fans or expensive cooling systems. ATS-04H-168-C1-R0 is one type of thermal-heat sink that offers a number of features to enhance its efficiency. In this article, we will discuss the application field and working principle of the ATS-04H-168-C1-R0 thermal-heat sink.
The ATS-04H-168-C1-R0 thermal-heat sink is designed for medium to high-power density applications, making it suitable for multi-faceted applications ranging from telecoms to commercial industries. It is composed of aluminum alloy and has a thermal resistance of 0.169 degree C/W. The heat sink also features vertical fins that maximize surface area for optimum heat transfer from the component to the air. The heat sink has a max temperature rating of up to 150 degrees C with a thermal performance of up to 60 Watts, depending on the configuration.
When applied to cooling the electronics enclosed, the ATS-04H-168-C1-R0 thermal-heat sink has a primary role of transferring heat from the component to the atmosphere by convection. It works by allowing air to flow over the fins, mitigating the heat of the component and transferring it to the atmosphere in the form of thermal energy. The number of fins on the thermal-heat sink increases the surface area, letting more air flow over it, which improves the cooling performance. The stiffness and rigidity provided by the thermal-heat sink’s aluminum alloy construction also leads to improved air throughput to ensure maximum cooling performance.
Overall, the ATS-04H-168-C1-R0 thermal-heat sink is well-suited for a wide range of applications due to its combination of features. Its high-power density capacity, low thermal resistance, maximum temperature rating and vertical fins offer improved cooling efficiency. It is an effective and cost-efficient way to dissipate heat from components without the need for an external fan or an expensive cooling system. It remains an indispensable tool in the modern industry, providing improved reliability and performance with its effective heat-dissipation.
The specific data is subject to PDF, and the above content is for reference