| Allicdata Part #: | ATS-04H-169-C1-R0-ND |
| Manufacturer Part#: |
ATS-04H-169-C1-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-169-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal energy management systems rely on the use of various components such as heat sinks to dissipate heat and maintain efficient operation temperatures. Heat sinks can be composed of fans, heat pipes, and other materials that effectively radiate or dissipate heat. One such device used for the efficient management of heat is the ATS-04H-186-C1-R0 Heat Sink. This device is primarily used to dissipate heat from power amplifiers and other components in electronic devices.
The ATS-04H-169-C1-R0 Heat Sink is designed to provide rugged, reliable thermal management in the most demanding environments. This model is composed of a unique set of features, retaining an operating life of over 20,000 hours and is capable of dissipating a considerable amount of heat generated by power amplifiers. Its design adherence to the environmentally friendly RoHS standards ensures that environmental pollution is kept at a minimum, thus reducing the negative effects of heat dissipation and making this model an excellent choice for electronic component thermal management.
The ATS-04H-169-C1-R0 Heat Sink features a highly efficient thermal design taking advantage of copper base and aluminum extrusion heat radiation fins which provide an overall effective thermal conduction solution to dissipate heat. Furthermore, the device also utilizes a heat pipe cooling system with liquid-filled tubes that actually draw heat away from the amplifier module and spread it to the cooling fins. The heat pipe can be constructed from any number of materials, such as aluminum, copper, nickel, and even polyamide.
The ATS-04H-169-C1-R0 Heat Sink also has a built-in fan system which effectively ensures adequate air flow across the entire heat sink. This fan system is particularly useful for air-cooled systems and is designed to reduce the risk of thermal overload. The fan can be set to a specific speed such as Low, Medium, and High to ensure a balanced cooling performance. Additionally, the fan also has an adjustable vibration dampening mechanism which effectively minimizes the amount of noise emitted during operation.
Overall, the ATS-04H-169-C1-R0 Heat Sink provides a strong thermal management solution that is both efficient and reliable. Its robust design and excellent performance make it an ideal choice for power amplifiers and other electronic components which require optimal cooling over extended periods of time. With features such as an adjustable fan system, a heat pipe cooling system, and RoHS compliance, this device ensures that heat generated from electronic components can be effectively managed without causing any disruption to the environment.
The specific data is subject to PDF, and the above content is for reference