| Allicdata Part #: | ATS-04H-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-04H-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important considerations in modern electronic engineering. One common solution to dealing with excess heat generated by everyday electrical devices is the utilization of heat sinks. Heat sinks are designed with a variety of materials and can have different configurations and orientations to maintain and optimize heat dissipation. In this article, the application field and working principle of the popular ATS-04H-173-C1-R0 heat sink type will be discussed.
The ATS-04H-173-C1-R0 is a type of heat sink usually used in mid-range and high-end processors. It is designed particularly for power supplies, processor chips, and other components, primarily due to its compact size and efficient cooling capacity. The heat sink is constructed from an aluminum extrusion and features a fin stack to increase the surface area and increase the heat sink’s cooling efficiency. The aluminum housing is also equipped with a heat pipe to further dissipate the heat away from the component, allowing for enhanced cooling performance.
The working principle of the ATS-04H-173-C1-R0 is relatively simple. It utilizes the natural process of conduction to transfer heat from a hot surface to a cooler one. The aluminum surface of the heat sink, the fins, and the heat pipe all work together to draw heat away from the component and transfer it to the surrounding environment. The multiple paths for heat to flow to the environment results in greater heat dissipation. In addition, the heat pipe allows for heat to be transferred quickly and evenly throughout the entire unit, allowing for maximum efficiency. In contrast, if the heat was not uniformly transferred, the component would be more susceptible to heat damage due to uneven heat distribution.
The ATS-04H-173-C1-R0 has a wide range of applications and is well-suited for higher wattage components in mobile, consumer, and industrial hardware. It is designed to perform well in high-powered components such as PC processors, GPUs, and gaming consoles. In addition, the ATS-04H-173-C1-R0 is suitable for other applications, including power supplies, LED lighting, medical equipment, and more. Its ability to dissipate heat efficiently in a small form factor makes it well-suited for a variety of applications.
In conclusion, the ATS-04H-173-C1-R0 is a popular heat sink type that is generally used for mid-range and high-end processors. Its aluminum construction and fin stack provide great thermal performance and its heat pipe allows for faster and more even heat dissipation. The ATS-04H-173-C1-R0 is great for high-powered components and mobile, consumer, and industrial hardware, making it an ideal choice for those looking for efficient thermal management in a variety of applications.
The specific data is subject to PDF, and the above content is for reference