| Allicdata Part #: | ATS8889-ND |
| Manufacturer Part#: |
ATS-04H-191-C2-R0 |
| Price: | $ 4.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-191-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.44780 |
| 10 +: | $ 4.32621 |
| 25 +: | $ 4.08568 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential in nearly any appliance, industry, or system. Heat sinks are one of the most important components in dissipating heat from semiconductors and other hot components. The ATS-04H-191-C2-R0 heat sink is a high performance finned heat sink designed to provide efficient heat transfer and thermal energy dissipation in a wide range of applications.
The ATS-04H-191-C2-R0 heat sink is constructed from aluminum alloy extrusion with a black anodized finish. The design features a total of 4 heat dissipating fins, which ensures efficient heat transfer and dissipation. To further enhance performance, the heat sink has a built-in fan with a custom designed shroud. The fan speeds up the heat dissipation process, and the shroud helps to regulate airflow to ensure maximum cooling efficiency.
The ATS-04H-191-C2-R0 heat sink is designed for use in high power applications. It is suitable for use in semiconductor devices, power modules, power transformer and storage units. The use of this heat sink helps to improve the efficiency and reliability of the systems in which it is employed. The thermal design of the heat sink ensures excellent heat dissipation with low internal temperatures, thus allowing components to operate reliably under heavy load conditions.
In addition to the finned heat sink design, the ATS-04H-191-C2-R0 also includes an integrated fan control system. This system allows the user to adjust the fan speed to regulate the amount of airflow and cooling capacity. In some applications, it may be necessary to reduce the fan speed in order to achieve the desired level of cooling. The integrated fan control system makes this adjustment easy and allows users to optimize their thermal management systems.
The ATS-04H-191-C2-R0 heat sink provides efficient thermal energy dissipation in a wide range of applications. This makes it an ideal choice for heat sinks in power supplies, power amplifiers, medical and telecommunications equipment, and other electronic control systems. By utilizing this heat sink, the components in these systems can operate more reliably and last longer due to the improved thermal energy dissipation.
In addition to providing superior thermal energy dissipation, the ATS-04H-191-C2-R0 heat sink also features a slim profile and a lightweight design. This feature is particularly beneficial in applications such as smartphones, tablets, and other portable electronics. This is because the slim profile and lightweight design of the heat sink make it easy to include in the design of the equipment without adding much weight or bulk.
The ATS-04H-191-C2-R0 heat sink is an ideal solution for thermal management and energy dissipation needs. This high performance finned heat sink is designed to provide efficient cooling and thermal energy dissipation in a wide range of applications. The integrated fan control system allows users to adjust the fan speed to regulate the amount of airflow and cooling capacity in their devices. Additionally, the slim profile and lightweight design help make this heat sink ideal for use in smartphones, tablets, and portable electronics.
The specific data is subject to PDF, and the above content is for reference