ATS-04H-195-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04H-195-C1-R0-ND

Manufacturer Part#:

ATS-04H-195-C1-R0

Price: $ 3.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04H-195-C1-R0 datasheetATS-04H-195-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.81736
30 +: $ 2.74134
50 +: $ 2.58905
100 +: $ 2.43671
250 +: $ 2.28446
500 +: $ 2.20830
1000 +: $ 1.97985
Stock 1000Can Ship Immediately
$ 3.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.88°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical to the operation and longevity of electronic devices. As components become smaller and more powerful, additional cooling components are often required to keep temperatures at a safe level. Heat sinks are one of the most common forms of thermal management, and the ATS-04H-195-C1-R0 is a good example of what a heat sink can offer.

The ATS-04H-195-C1-R0 is a low-profile heat sink designed for cooling small, highly integrated components. It measures only 20mm x 20mm, making it ideal for use in tight spaces, and its simple design allows it to be mounted easily and cost-effectively. The ATS-04H-195-C1-R0 is made from high-grade aluminum and uses a slotted fin design for optimal heat dissipation. It also features raised edges, which improves its ability to efficiently move heat away from the component.

The primary application for the ATS-04H-195-C1-R0 is in cooling integrated circuit packages such as DIP, SOIC, QFP, and QFN packages. It can also be used in a wide range of other applications, such as small motor cooling, LED light cooling, and other applications requiring thermal management. It can also be combined with a fan for increased cooling efficiency.

The ATS-04H-195-C1-R0 works on a simple principle of convection. The aluminum fins and raised edges of the heat sink form a maze-like structure, which increases the surface area of the heat sink and accelerates air flow. As warm air rises from the package, it is drawn into the maze and forced to flow through it. The heat is then dissipated by the aluminum fins as cooler air is drawn in.

The ATS-04H-195-C1-R0 is a popular choice for a variety of thermal management applications, particularly in the aerospace, defense, medical, and industrial sectors. It is capable of providing effective cooling at a range of temperatures and is an excellent choice for applications that require low-profile, highly efficient cooling.

The specific data is subject to PDF, and the above content is for reference

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